Polyamic acid composition, polyimide copper-clad plate and circuit board

A technology of polyamic acid and polyimide film, which is applied in the direction of circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of low bonding force of copper foil, low bonding force of copper foil and polyimide film, etc. To achieve the effect of improving bonding strength, reducing mobility and reducing dielectric loss

Pending Publication Date: 2021-01-19
ZHEN DING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing polyimide film has low bonding force to copper foil with low surface roughness. When using copper foil with low surface roughness to make copper clad laminate, the bonding force between copper foil and polyimide film lower

Method used

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  • Polyamic acid composition, polyimide copper-clad plate and circuit board
  • Polyamic acid composition, polyimide copper-clad plate and circuit board
  • Polyamic acid composition, polyimide copper-clad plate and circuit board

Examples

Experimental program
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preparation example Construction

[0054] The preparation method of the polyamic acid composition can be: adding the diamine monomer containing the liquid crystal unit, the diamine monomer containing the soft structure and the diamine monomer containing the nitrogen heterocycle into a reaction bottle with a solvent; Stir to completely dissolve the diamine monomer containing the liquid crystal unit, the diamine monomer containing the soft structure and the diamine monomer containing the nitrogen heterocycle in the solvent; then, the dianhydride monomer containing the liquid crystal unit or the diamine monomer containing the soft structure At least one of the dianhydride monomers is added into the reaction flask, stirred and reacted for a period of time to obtain a polyamic acid composition. Wherein, the solvent is preferably a bipolar aprotic solvent. The bipolar aprotic solvent may be dimethylformamide (DMF), dimethylacetamide (DMAC), N-methylpyrrolidone (NMP), dimethylsulfoxide (DMSO) and the like. The added ...

Embodiment 1

[0068] Add NMP (203.37g), APAB (0.068mol, 15.52g), ODA (0.027mol, 5.41g), DTZ (0.005mol, 0.50g) into a 500mL reaction bottle, stir at high speed until dissolved, then add BPDA (0.1mol, 29.42g) under anhydrous nitrogen environment, stirred and reacted at lower than room temperature for 48 hours, that is, the polyamic acid composition was prepared.

Embodiment 2

[0070] Add NMP (205.77g), APAB (0.078mol, 17.80g), ODA (0.017mol, 3.40g), DTZ (0.005mol, 0.50g) into a 500mL reaction bottle, stir at high speed until dissolved, then add ODPA (0.02mol, 6.20g), BPDA (0.08mol, 23.54g) were stirred and reacted for 48 hours below room temperature under anhydrous nitrogen environment, and the polyamic acid composition was prepared.

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PUM

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Abstract

A polyamic acid composition is formed by polymerizing a dianhydride monomer and a diamine monomer, and the molar ratio of the dianhydride monomer to the diamine monomer ranges from 0.9 to 1.1. the diamine monomer comprises a diamine monomer containing a liquid crystal unit, a diamine monomer containing a soft structure and a diamine monomer containing a nitrogen heterocyclic ring; in the diamine monomer, the molar percentage of the diamine monomer containing the nitrogen heterocyclic ring is 3%-8%, and the sum of the molar percentage of the diamine monomer containing the liquid crystal unit and the molar percentage of the diamine monomer containing the soft structure is 92%-97%. The invention also provides a polyimide copper-clad plate prepared by cyclizing the polyamide acid composition and a circuit board prepared by applying the polyimide copper-clad plate.

Description

technical field [0001] The invention relates to a polyamic acid composition, a polyimide copper-clad board prepared by cyclization of the polyamic acid composition and a circuit board prepared by using the polyimide copper-clad board. Background technique [0002] In recent years, printed circuit boards have been widely used in various electronic products. At present, printed circuit boards are generally made of copper clad laminates as the base material. Wherein, the copper clad laminate includes copper foil, a polyimide film, and an adhesive layer between the copper foil and the polyimide film for combining the copper foil and the polyimide film. [0003] During the production process of the circuit board, part of the copper foil bonded to the surface of the polyimide film will be etched away, so that the polyimide film in this area is not bonded to the copper foil and exposed. A CCD camera is used to see through the polyimide film without copper foil for precise positio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18H05K1/03
CPCC08G73/1042C08G73/1053C08G73/1082C08G73/1007C08J5/18H05K1/0313C08J2379/08C08G73/1071C08G73/1085C09K19/56C09K2019/3004C09K2019/3009C09K2019/122C09K2019/161C09K2019/181C09K2019/2035C09K19/22C09K2019/183C09K19/18C09K2019/163C09K19/16C09K2019/2042C09K19/2028H05K2201/0154H05K1/0346C08G73/1067C08L79/08C09K19/12C09K19/3003B32B15/088C08L2203/16B32B15/20
Inventor 苏赐祥吴佩蓉李冠纬向首睿
Owner ZHEN DING TECH CO LTD
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