Supercharge Your Innovation With Domain-Expert AI Agents!

Resin composition

A resin composition, polyimide resin technology, applied in the direction of electrical components, printed circuits, circuit substrate materials, etc., to achieve the effect of low thermal expansion coefficient and warpage suppression

Pending Publication Date: 2021-01-29
AJINOMOTO CO INC
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the two-layer film has problems in terms of cost and productivity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition
  • Resin composition
  • Resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0240] Hereinafter, the present invention will be specifically described by way of examples. The present invention is not limited by these examples. In addition, below, unless otherwise specified, "part" and "%" which show an amount mean "mass part" and "mass %", respectively.

Synthetic example 1

[0241]

[0242] In a 500ml detachable flask equipped with a nitrogen introduction tube and a stirring device, 9.13 g (30 mmoles) of 4-aminobenzoic acid 5-amino-1,1'-biphenyl-2-yl ester, 4,4' -(4,4'-isopropylidenediphenoxy)diphthalic dianhydride 15.61g (30mmol), N-methyl-2-pyrrolidone 94.64g, pyridine 0.47g (6mmol) 10 g of toluene, under a nitrogen atmosphere, at 180° C., carry out imidization reaction for 4 hours while discharging toluene to the outside of the system on the way, thereby obtaining a polyimide solution containing polyimide resin 1 (20% by mass of non-volatile components). In the polyimide solution, precipitation of the synthesized polyimide resin 1 was not observed.

Synthetic example 2

[0243]

[0244] Aromatic tetracarboxylic dianhydride ("BisDA-1000" manufactured by SABIC Japan, 4,4'-(4,4'-isopropylene (diphenoxy) diphthalic dianhydride) 65.0 g, cyclohexanone 266.5 g, and methylcyclohexane 44.4 g, and the solution was heated to 60°C. Next, 43.7 g of dimer diamine (“PRIAMINE 1075” manufactured by Croda Japan Co., Ltd.) and 5.4 g of 1,3-bis(aminomethyl)cyclohexane were added dropwise, and then allowed to cool at 140° C. for 1 hour. Carry out imidization reaction. Thereby, the polyimide solution (30 mass % of non-volatile matter) containing the polyimide resin 2 was obtained. In addition, the weight average molecular weight of the polyimide resin 2 was 25,000.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
surface roughnessaaaaaaaaaa
Login to View More

Abstract

The present invention addresses the problem of providing a resin composition with which it is possible to obtain a cured product having a low coefficient of thermal expansion and suppressed warpage. The resin composition contains (A) a polyimide resin and (B) a siloxane-containing polycarbonate resin.

Description

technical field [0001] The present invention relates to a resin composition comprising a polyimide resin. It further relates to a cured product obtained by using the resin composition, a resin sheet, a multilayer flexible substrate, and a semiconductor device. Background technique [0002] In recent years, there has been an increasing demand for semiconductor components that are thinner, lighter, and have a higher mounting density. In order to meet this demand, attention has been paid to utilizing a flexible substrate as a base substrate used in semiconductor components. Flexible substrates can be thinner and lighter than rigid substrates. In addition, the flexible substrate can be bent and installed because it is soft and deformable. [0003] A flexible substrate is generally manufactured by performing the following steps: making a three-layer film formed of a polyimide film, a copper foil, and an adhesive, or a two-layer film formed of a polyimide film and a conductor l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L69/00C08L63/00C08L63/02C08K9/06C08K7/18C08G73/10C08G64/18C08J5/18H05K1/03
CPCC08L79/08C08J5/18H05K1/0353C08G73/1071C08G73/1007C08G73/1053C08G73/1046C08G64/186C08J2379/08C08J2469/00C08L2205/025C08L2205/035C08K2201/006C08K2201/005C08L69/00C08L63/00C08K9/06C08K7/18C08L83/10C08G64/04C08G77/448C08G77/20C08G59/4276C08K3/36H05K1/0373
Inventor 鹤井一彦
Owner AJINOMOTO CO INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com