Manufacturing method of box dam ceramic substrate for ultraviolet LED packaging and product thereof

Abstract

.The invention discloses a manufacturing method of a box dam ceramic substrate for ultraviolet LED packaging and a product thereof. According to the method, local localized heating instead of overallheating is carried out on the contact surface of the ceramic substrate and the box dam through laser, so that the process is simple and energy-saving, batch production is facilitated, and thermal damage to original circuit metal of the ceramic substrate caused by high temperature is effectively avoided Meanwhile, compared with existing gluing or reflow soldering, laser welding forms reliable welding, welding points can bear higher temperature, and the reliability is higher; compared with an existing metal box dam, the box dam is made of glass or ceramic or glass ceramic or sapphire materials,the expansion coefficient of the box dam is better matched with that of the ceramic substrate, and the product reliability is further improved. Meanwhile, the metal coating is arranged on the inner wall of the box dam, ultraviolet light can be well reflected, the problem of ultraviolet light absorption is avoided, the comprehensive performance is good, and wide application and popularization are facilitated.

Description

technical field [0001] The present invention relates to the technical field of manufacturing methods of dam ceramic substrates, in particular to a manufacturing method of dam ceramic substrates used for ultraviolet LED packaging and products thereof. Background technique [0002] Existing LED packaging devices using DPC ceramic substrates generally use organic materials such as silica gel and epoxy as sealing materials. Ultraviolet LEDs, especially UV-C ultraviolet LEDs, will cause photodegradation to organic materials, causing aging and even cracking of materials. Therefore, the DPC ceramic substrate used in UV LEDs generally has a dam structure. The dam structure is generally made of metal material, which can protect the LED chip to a certain extent and facilitate the installation of the lens structure. Since the UV LED package has high airtightness requirements, the connection between the dam and the ceramic substrate also requires high airtightness requirements. [00...

AI Technical Summary

Problems solved by technology

The expansion coefficient of metal copper and ceramics is too different, and the packaged devices work at high temperature for a long time, which will cause great stress and affect the reliability of the product. Moreover, high-power ultraviolet LEDs have high requirements for heat dissipation, so ceramic substrates are mostly made of aluminum nitride. Material

The thermal expansion coefficient of the dam material used in the existing technology is quite different from that of aluminum nitride. In practical applications, it is easy to cause the dam to separate from the ceramic substrate, or the aluminum nitride substrate is cracked due to stress pulling, and there is a large quality risk.

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