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Millimeter wave waveguide power combiner

A technology of power combiner and millimeter wave, which is applied in the direction of waveguide devices, electrical components, connecting devices, etc., can solve the problems of low life, poor heat dissipation performance, and inability to meet the requirements of millimeter wave solid-state high-power output, etc., and achieve good Excellent heat dissipation characteristics, low insertion loss, and simple structure

Inactive Publication Date: 2021-01-29
NANJING UNIV OF POSTS & TELECOMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the existing waveguide power combiner has low loss and high isolation, it has poor heat dissipation performance and low lifespan, and cannot meet the requirements of millimeter-wave solid-state high-power output

Method used

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  • Millimeter wave waveguide power combiner
  • Millimeter wave waveguide power combiner
  • Millimeter wave waveguide power combiner

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Embodiment Construction

[0010] like figure 1 , figure 2 As shown, the millimeter-wave waveguide power combiner includes an input waveguide 1, a driver amplifier chip 3, and a power amplifier chip 6. The driver amplifier chip 3 and the power amplifier chip 6 are placed on a dielectric substrate, and the dielectric constant of the dielectric substrate is 2.2. The input The end waveguide 1 is connected to the driving output waveguide 5, the driving amplifier chip 3 is connected to the driving output waveguide 5, the driving output waveguide 5 is connected to the waveguide power division structure, the driving output waveguide 5 and the waveguide power division structure are connected through the transition cavity 4, and the waveguide power division structure Including two branch cavities, the power amplifier chip is located in the branch cavity, and the branch cavities are connected to the output waveguide 7 after summarization, between the input waveguide 1 and the driving output waveguide 5, and betw...

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PUM

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Abstract

The invention discloses a millimeter wave waveguide power combiner. The combiner comprises an input end waveguide, a driving amplification chip and a power amplification chip, the input end waveguideis connected with a driving output waveguide, the driving amplification chip is connected with the driving output waveguide, the driving output waveguide is connected with a waveguide power division structure, and the waveguide power division structure is connected with the power amplification chip and the output end waveguide; and the input end waveguide is connected with the driving output waveguide through a microstrip line, and the output end waveguide is connected with the waveguide power dividing structure through a microstrip line. The millimeter wave waveguide power combiner is small in insertion loss and return loss, has a branch with high isolation degree, can provide good heat dissipation characteristics, has large-scale space power combining potential, and is simple in structure and easy to manufacture.

Description

technical field [0001] The present invention relates to a waveguide power combiner, more specifically, to a millimeter wave waveguide power combiner. Background technique [0002] The millimeter wave power output device is one of the core devices of the millimeter wave system. Traditional vacuum electronic devices such as klystrons and traveling wave tubes still play an important role in many fields with high power requirements due to their high efficiency and high power output capabilities in the millimeter wave frequency band. Vacuum electronic devices can output large power, but they have disadvantages such as high operating voltage, low reliability, and short life. Millimeter-wave solid-state devices have the advantages of low operating voltage, high reliability, and long life, and have attracted much attention from researchers. The rapid development of semiconductor and computer simulation technology has promoted the development of microwave and millimeter wave solid-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/00
CPCH01P5/00
Inventor 陈董袁锴雷蕾张洪林
Owner NANJING UNIV OF POSTS & TELECOMM
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