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Multilayer Electronic Assemblies

An electronic component and dielectric technology, applied in the field of multi-layer electronic components, can solve the problems of low bonding strength, deterioration of moisture resistance reliability, cracking, etc.

Active Publication Date: 2022-02-22
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Boundaries are prone to delamination and cracking due to low bonding strength between dissimilar materials
In addition, delamination and cracking may lead to deterioration of moisture resistance reliability

Method used

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  • Multilayer Electronic Assemblies
  • Multilayer Electronic Assemblies
  • Multilayer Electronic Assemblies

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0112] Table 1 shows evaluations of chip strength, humidity resistance reliability, and withstand voltage characteristics depending on changes in dielectric filling ratio.

[0113] Measured in a 60 μm×40 μm area of ​​the central portion of the main body after scanning images of cross-sections (W-T cross-sections) in the first and third directions at the center of the main body in the second direction with a scanning electron microscope (SEM) Internal electrode connectivity and dielectric fill.

[0114] Chip strength was measured as compressive breaking strength using a Universal Testing Machine (UTM). In the case of Test No. 7 with a chip strength of 100%, the relative strength was measured and listed in Table 1.

[0115] When a reference voltage of 2 Vr was applied for 12 hours at a temperature of 85°C and a relative humidity of 85%, by examining samples having an insulation resistance value lower by 1 / 10 or less than the initial value among 400 samples The quantity to meas...

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Abstract

The present invention provides a multilayer electronic component, which includes: a main body including dielectric layers and internal electrodes alternately arranged in a first direction; and external electrodes provided on the main body to be connected to the the internal electrodes. At least one of the internal electrodes includes a plurality of disconnections penetrating the corresponding internal electrode. A disconnection of the plurality of disconnections includes at least one of a void and a dielectric disposed to connect adjacent dielectric layers to each other. The dielectric filling rate is greater than 20% and less than 80%, and the dielectric filling rate is defined as: the total length of the dielectric and the total length ratio.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2019-0091562 filed with the Korean Intellectual Property Office on July 29, 2019, the entire disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer electronic assembly. Background technique [0003] Multilayer ceramic capacitors (MLCCs), a type of capacitor component, are chip capacitors that are mounted in various applications such as imaging devices (such as liquid crystal displays (LCD) and plasma display panels (PDP)), computers, smartphones, and mobile phones. A printed circuit board of an electronic product for charging or discharging. [0004] Such MLCCs are useful as components of various electronic devices due to their advantages such as compactness, high-capacity assurance, and ease of installation. Since various electronic devices such as computers and mobile devices are small in size and high in powe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G4/30
CPCH01G4/1218H01G4/30H01G4/005H01G4/012H01G4/0085H01G4/14H01G4/08
Inventor 车炅津申旴澈李承熙吴范奭
Owner SAMSUNG ELECTRO MECHANICS CO LTD