Wood flour reinforced micro-foaming polyamide compound with low dielectric constant and high dielectric strength and preparation method of wood flour reinforced micro-foaming polyamide compound

Abstract

The invention discloses a wood flour reinforced micro-foaming polyamide compound with low dielectric constant and high dielectric strength and a preparation method of the compound. The wood flour reinforced micro-foaming polyamide compound is prepared from the following raw materials in parts by weight: 39-93.8 parts of polyamide; 5-30 parts of wood flour; 1-6 parts of an ionic polymer; 1-3 partsof a microsphere foaming agent; 0-20 parts of a reinforced filling material; 0.1-1 part of a lubricant; and 0.1-1 part of a stabilizing agent. The compound has the advantages that the dielectric strength is high while a low dielectric constant is obtained, high mechanical performance is kept, potential safety hazards are reduced, and the material can be used under various working conditions of 5G;a composite material with a low dielectric constant is obtained by utilizing the dual effects of a micro-foaming process and the low dielectric constant of wood flour; the high dielectric strength ofthe wood flour is utilized to compensate influence of micro-foaming on the dielectric strength; and traditional biomass wood flour resources are combined with 5G in the front edge of modern science and technology development, and new age characteristics are given to the environmental protection concept.

Description

technical field [0001] The invention relates to composite materials, in particular to a low dielectric constant, high dielectric strength wood powder reinforced micro-foaming polyamide composite and a preparation method thereof. Background technique [0002] With the development of 5G communication technology, it will be widely used in smart home, smart home appliances, smart media, smart cars, smart transportation and other fields. At the same time, the demand for low dielectric constant materials matching the above-mentioned 5G communication equipment is also imminent. The dielectric constant has a great influence on the signal transmission speed, signal delay, and signal loss of 5G communication millimeter wave. In the case of 5G high-frequency transmission, materials with low dielectric constant and low dielectric loss are very useful. [0003] Modified plastics can be used in the frame, cover, shell, bracket and other parts of equipment in the 5G era. Modified plastics...

AI Technical Summary

Problems solved by technology

However, due to the existence of micropores in the above-mentioned various microfoaming materials, while obtaining a low dielectric constant, it has caused a negative impact of low dielectric strength. If it is used in parts such as smart electromechanical housings, it will It is easy to be broken down, and there are certain safety hazards

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