Device and method for detecting bonding strength of bimetallic plate

Abstract

The invention provides a bimetallic plate bonding strength detection device, which comprises a middle rolling ball mold frame, a sample clamping assembly and a cutter, and is characterized in that themiddle rolling ball mold frame comprises an upper mold plate and a lower mold plate which are horizontally arranged, the upper mold plate and the lower mold plate are movably connected through a movable connecting piece, the upper mold plate can move up and down relatively, a positioning fixing block is arranged on the upper end surface of the lower template, the sample clamping assembly is mounted on the positioning fixing block, the sample clamping assembly is used for clamping a sample, a cutter fixing block is arranged on the lower end surface of the upper template, the cutter is mountedon the cutter fixing block, and the cutter is used for shearing the sample. According to the invention, by taking a steel backing and copper alloy bimetallic material as an example, the detection device is suitable for detecting the bimetallic bonding strength that the thickness of a steel backing layer is greater than or equal to 2 mm and the thickness of a copper alloy layer is greater than or equal to 0.5 mm, the operation and implementation are simple, the influence of other external interference factors is reduced, the repeatability of a test result is good, and the measured data is moreaccurate and reliable.

Description

technical field [0001] The invention relates to the field of performance testing of bimetallic plates, in particular to a detection device and a detection method for the bonding strength of the bonding interface of bimetallic plates. Background technique [0002] Composite material is composed of two or more layers of metals with different properties. Because it has excellent comprehensive properties that the original single material does not have, it is widely used in aerospace, petrochemical, metallurgy, automobile, shipbuilding, electric power, medicine, etc. Health, environmental protection, nuclear energy and household appliances and other fields have broad application prospects. [0003] There are many indicators to measure the quality of metal composite panels. The common indicators include shear strength, bond strength, bonding degree, yield strength, tensile strength, etc. Among them, the shear strength can best explain the level of bonding strength of the metal com...

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Problems solved by technology

[0003] There are many indicators to measure the quality of metal composite panels. The common indicators include shear strength, bond strength, bonding degree, yield strength, tensile strength, etc. Among them, the shear strength can best explain the level of bonding strength of the metal composite panel interface. , so the frequency of use is the highest. The test method and shear test equipment for the shear strength of metal laminated composite panels are regulated in GB / T6396-2008. It is divided into two categories: the total thickness of the composite board is less than or equal to 10mm and the total thickness is greater than 10mm. When the total thickness of the composite board is relatively thin (the standard specifies that it is less than or equal to 10mm), the matrix will bend and deform under pressure. Affect the test accuracy, and even the shear strength value cannot be measured at all. At this time, the national standard GB / T6396-2008 stipulates that the tensile shear method is used to test the shear strength, but this method is only applicable to the case where the composite layer is relatively thick. When it is thin, its weakest part is prone to bending and breaking during the tensile and shearing process, which affects the test accuracy and even makes the test fail. There are other detection methods in the industry, and there are some additional influencing factors, such as Type test sample, wherein, the vertical bar represents one of the metal substrates, such as the steel back layer, and the small protrusion in the middle represents the attached metal layer (such as the copper alloy layer), and the attached metal layer around it is processed and removed. The processing of the sample is complicated, and it is difficult to ensure that most of the area of ​​a metal can be milled off. The shallow and deep milling will affect the final test results, and there will inevitably be friction between the sample and the tooling. Therefore, , the present invention provides a detection device and detection method for the bonding strength of bimetallic plates capable of solving the above problems

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