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Base region resistance control thyristor structure and manufacturing method thereof

A technology of base resistors and thyristors, which is applied in the manufacture of thyristors, semiconductor/solid-state devices, circuits, etc., can solve the problems of rising rate of opening current, low peak current, failure to meet the requirements of pulse power and solid-state circuit breaker applications, and achieve acceleration Turn-on, increase the rate of rise of the turn-on current, and facilitate popularization and utilization

Pending Publication Date: 2021-02-19
XIAN UNIV OF TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a base resistance controlled thyristor, which solves the problem that the device structure in the prior art has a low turn-on current rise rate and peak current due to the negative resistance phenomenon, and cannot meet the application requirements in the field of pulse power and solid-state circuit breakers. question

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  • Base region resistance control thyristor structure and manufacturing method thereof
  • Base region resistance control thyristor structure and manufacturing method thereof
  • Base region resistance control thyristor structure and manufacturing method thereof

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] refer to figure 1 , the basic cell structure (the first structure) of the base region resistance controlled thyristor of the present invention is, with n - The drift region acts as a voltage-resistant layer, n - A p base area is set in the center above the drift region, and an n base area is set in the center above the p base area. + In the cathode region, there are n regions on both sides of the p base region, and p ++ shunt area, p ++ The aluminum layer on the upper surface of the shunt area and n + The aluminum layer on the upper surface of the cathode area is connected to form the cathode electrode K; the n area on both sides, the p base area, and part of the n area + Cathode area and part p ++ A layer of gate oxide layer (i.e. SiO 2 Material layer), a heavily doped polysilicon layer is arranged on the upper surface of the g...

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Abstract

The present invention discloses a base region resistance control thyristor structure. A p base region is arranged in the center of the upper portion of an n- drift region, an n+ cathode region is arranged in the center of the upper portion of the p base region, n regions are arranged on the two sides of the p base region respectively, a p++ shunt region is arranged in the n region on the right side, and an aluminum layer on the upper surface of the p++ shunt region is connected with an aluminum layer on the upper surface of the n+ cathode region to form a cathode K; a gate oxide layer is arranged on the upper surfaces of the n regions on the two sides, the p base region, part of the n+ cathode region and part of the p++ shunt region, and a gate G is arranged on the upper surface of the gate oxide layer; a phosphorosilicate glass layer is arranged between the cathode electrode K and the grid electrode G; and an n FS layer, a p+ anode region and a metallized anode A are sequentially arranged on the lower surface of the n- drift region. The invention further discloses a manufacturing method of the base region resistance control thyristor. The method is low in process cost and convenient to popularize and use, and can better meet the application requirements in the fields of pulse power and solid-state circuit breakers.

Description

technical field [0001] The invention belongs to the technical field of power semiconductor devices, and relates to a base resistance controlled thyristor structure, and also relates to a manufacturing method of the base resistance controlled thyristor structure. Background technique [0002] The traditional MOS-controlled thyristor (MCT) has the advantages of high input impedance, easy driving, low on-state voltage drop and conduction loss, but the process is difficult; the traditional base resistance controlled thyristor (BRT) can solve the difficult MCT process. The problem is that its on-state voltage drop is also similar to MCT, but due to the discharge of hole current when BRT is turned on, it is difficult to turn on and cannot guarantee a high current rise rate. Contents of the invention [0003] The purpose of the present invention is to provide a base resistance controlled thyristor, which solves the problem that the device structure in the prior art has a low turn...

Claims

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Application Information

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IPC IPC(8): H01L29/74H01L29/06H01L21/332
CPCH01L29/74H01L29/0607H01L29/0684H01L29/66363
Inventor 王彩琳苏乐杨晶杨武华
Owner XIAN UNIV OF TECH
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