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Process method for cutting quartz crystal wafers through diamond wires

A technology of diamond wire cutting and quartz wafers, applied in stone processing equipment, fine working devices, working accessories, etc., can solve the problems of oil sand environmental pollution, large tolerances of wafer thickness and angle, and long time-consuming, etc., to reduce production Effects of cost, tight wafer thickness and angle tolerances, avoidance of contamination

Active Publication Date: 2021-02-26
TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO LTD
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Problems solved by technology

[0003] The invention provides a process method for cutting quartz wafers by diamond wire, which aims to solve the problems of long time-consuming mortar multi-wire cutting method, large wafer thickness and angle tolerance after cutting, and environmental pollution caused by oil sand, so as to improve work efficiency and reduce production. purpose of cost

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  • Process method for cutting quartz crystal wafers through diamond wires
  • Process method for cutting quartz crystal wafers through diamond wires

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] The invention provides a process method for cutting quartz wafers by diamond wire, which is matched with CNC multi-wire cutting equipment, and the workpiece feed speed segmentation mode is created in the operation program of CNC multi-wire cutting equipment, and the numerical control multi-wire cutting The feed stroke of the worktable of the equipment is divided into several sections. During the cutting process, the feed speed of the worktable is controlled for different sections of the feed stroke of the worktable.

[0023] See Figure 1, figure 2 , the specific embodiment of the present invention is: the blank to be cut that it aims at comprises guide strip I, quartz crystal material and backing plate V, wherein the quartz crystal material is made of the first quartz crystal material II and the second quartz crystal material that are s...

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Abstract

A process method for cutting quartz crystal wafers through diamond wires is matched with numerical control multi-wire cutting equipment, a workpiece feeding speed segmentation mode is created in an operation program of the numerical control multi-wire cutting equipment, and correspondingly, the feeding stroke of a workbench of the numerical control multi-wire cutting equipment is equally divided into a plurality of sections; and in the cutting procedure, the feeding speed of the workbench is controlled according to the different sections of the feeding stroke of the workbench. According to theprocess method, the problems that in a mortar multi-wire cutting method, the consumed time long, the thickness and angle tolerance of cut crystal wafers are large, and oil sand pollutes the environment are solved, and the purposes of improving the working efficiency and reducing the production cost are achieved.

Description

technical field [0001] The invention relates to a cutting process method for a quartz wafer, in particular to a process method for cutting a quartz wafer by a diamond wire. Background technique [0002] At present, for the cutting of quartz wafers, most of the mortar multi-wire cutting methods are used, and the mortar multi-wire cutting method is to drive the mortar to grind and cut through the rapid reciprocating motion of the steel wire. Since the workpiece is fed at a uniform speed during the cutting process, The cutting speed is a constant value, which not only has the defects of long cutting process and low work efficiency, but also has a large thickness and angle tolerance of the wafer after cutting (the thickness tolerance of the mortar multi-wire cutting wafer is ≤0.033mm, and the angle tolerance is about ±84″ ), and even some wafers cannot be used due to their thickness or angle being out of tolerance, resulting in a waste of raw materials; in addition, the oil sand...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/045B28D5/0064
Inventor 赵桂红郑玉南徐建民郝建军李永斌崔立志张勇段宗涛杨铁生狄建兴杨秀霞
Owner TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO LTD
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