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Transfer method of chip device

A transfer method and device technology, which is applied in the field of chip manufacturing, can solve problems such as chip flipping and offset, insufficient chip consistency, and affect the alignment accuracy, and achieve high yield, drop accuracy and good product rate.

Pending Publication Date: 2021-03-12
昆山麦沄显示技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] This application provides a method for transferring chip devices to solve the technical problem that in the prior art, the consistency between the chip and the adhesive film is not enough, so that the chip will be flipped and shifted when it is dropped, and the arrangement accuracy will be affected.

Method used

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  • Transfer method of chip device

Examples

Experimental program
Comparison scheme
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Embodiment approach

[0058] S41: Place a mask plate 180 on the temporary substrate layer 150 to determine that the chip device 120 at the corresponding position falls off.

[0059] see Figure 13 , the mask plate 180 has a light-transmitting area and an opaque area, and the position of the chip device 120 that does not need to be put down corresponds to the light-transmitting area of ​​the mask plate 180, and the position of the chip device 120 that needs to be put down corresponds to the transparent area. In the light area, under the irradiation of laser light, the chip device 120 at the position of the corresponding light-transmissive area can be detached and transferred.

[0060] S42: Irradiate one side of the temporary substrate layer 150 with a laser of ultraviolet wavelength.

[0061] By irradiating the temporary substrate layer 150 from the light-transmitting position where the mask plate 180 is placed, the bonding layer 130 or the laser sacrificial layer 140 at the corresponding position ...

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PUM

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Abstract

The invention provides a transfer method of a chip device, which comprises the steps of forming a bonding layer and a temporary substrate layer on a support substrate provided with a plurality of chipdevices, and removing the support substrate in a laser lift-off, chemical corrosion or grinding mode to transfer the plurality of chip devices to the temporary substrate layer, and etching the bonding layer to expose the side walls of the plurality of chip devices, removing the bonding layer to enable the plurality of chip devices to fall off from the temporary substrate layer, and carrying the plurality of chip devices through the carrying carrier. Through the above mode, according to the the transfer method provided by the invention, it is easier to realize uniform decomposition of the bonding layer, thereby guaranteeing the falling precision and yield in the chip transfer process, and realizing graphical ordered arrangement and transfer of the chip devices.

Description

technical field [0001] The present application relates to the technical field of chip manufacturing, in particular to a method for transferring chip devices. Background technique [0002] The chip manufacturing process mainly includes wafer fabrication, wafer coating, wafer lithography development, etching, ion implantation, wafer testing, and packaging. In each processing process, chips need to be patterned and arranged in batches and transferred in an orderly manner. Among the existing technical solutions, one solution is to completely surround the chip with glue and transfer it by laser, but this fully covered structure will tightly hold the chip and cause the chip to fail to fall off well. Another solution is to bond the chip to the temporary substrate through an adhesive film, and then use a laser to decompose the adhesive film so that the chip falls off. However, the decomposition of the entire surface of the adhesive film is difficult to control. When the chip is re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L33/00
CPCH01L21/6835H01L33/005H01L2221/68368H01L2221/68381
Inventor 陈波
Owner 昆山麦沄显示技术有限公司