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The manufacturing method of a LTCC heat sink

A manufacturing method and technology for heat sinks, which are applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of increasing device volume, incompatible processes, and high production complexity, and achieve a simple and implementable manufacturing process. Strong performance and enhanced heat dissipation effect

Active Publication Date: 2022-08-09
KUNMING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using the traditional heat dissipation method for heat dissipation design will greatly increase the volume of the device, which is inconsistent with the design purpose of LTCC miniaturization, and the process is not compatible, and the production complexity is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The LTCC heat sink structure described in this embodiment is widely used in high-power LTCC modules. The integrated manufacturing of the LTCC heat dissipation function circuit is used as the whole single-chip LTCC module for heat dissipation of the entire LTCC module. This embodiment is a coplanar structure. For the LTCC heat sink, the P and N materials form a P and N coplanar structure on the same layer of LTCC film. The PN material is connected in series, and the galvanic couple composed of N-type and P-type thermoelectric materials works with an external DC power supply. The heat sink exists in the form of a galvanic couple, which is manufactured by the methods of paste printing, stack embedding, and low temperature co-firing compatible with the LTCC process. Printing, through-hole filling, low temperature co-firing process for built-in leads.

[0016] Taking the bismuth telluride thermoelectric material as an example, the bismuth telluride powder was obtained by th...

Embodiment 2

[0027] The LTCC heat sink in this experimental example is a single-piece LTCC heat sink, which can place high-power integrated circuits and high-power devices that need heat dissipation above the LTCC ceramic layer to achieve heat dissipation for devices and circuits. The galvanic couple composed of N-type and P-type thermoelectric materials works with an external DC power supply. The heat sink exists in the form of a galvanic couple, which is manufactured by the methods of paste printing, stack embedding, and low temperature co-firing compatible with the LTCC process. Printing, through-hole filling, low temperature co-firing process for built-in leads.

[0028] In this embodiment, the bismuth telluride thermoelectric material is taken as an example, and the bismuth telluride powder is obtained by the method of bulk bismuth telluride sputtering, and the LTCC heat sink is manufactured. The LTCC ceramic powder material is DuPont-943 produced by DuPont Company. The specific step...

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Abstract

The invention relates to a method for manufacturing an LTCC heat sink, belonging to the technical field of LTCC. The invention includes the following steps: (1) mixing and casting of the LTCC heat sink body; (2) cutting the LTCC heat sink body; (3) drilling through holes of the LTCC heat sink body; (4) thermoelectric material paste processing (6) Filling of through holes; (7) Printing of metal and thermoelectric materials; (8) Lamination; (9) Co-firing at low temperature, the present invention utilizes the galvanic coupling composed of N-type and P-type thermoelectric materials built into the LTCC. The external DC power supply works, and the N and P type thermoelectric materials are integrated with the LTCC multi-layer printing and low-temperature co-firing compatible processes, which are highly compatible with the LTCC process, which can ensure the small size of the LTCC module. It can also enhance the heat dissipation of LTCC device modules, and can be widely used in LED package heat dissipation, high-power device heat dissipation and LTCC package circuit heat dissipation.

Description

technical field [0001] The invention relates to a method for manufacturing an LTCC heat sink, belonging to the technical field of LTCC. Background technique [0002] Heat dissipation can enhance the reliability and environmental suitability of electronic devices, enabling the device to have an enhanced lifetime and the ability to operate in harsh environments. At present, the commonly used heat dissipation methods are air convection heat dissipation and water cooling heat dissipation, which are characterized by large volume, inability to miniaturize and integrate, and low heat dissipation efficiency. With its design and manufacturing advantages of miniaturization and high reliability, LTCC has rapidly become a hot spot in the manufacturing and R&D of high-performance electronic devices in recent years. During the design and manufacture of LTCC device modules, heat dissipation is a critical consideration that affects its performance. Using traditional heat dissipation metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/38
CPCH01L23/3672H01L23/38
Inventor 李小珍杨晓东邢孟江刘永红代传相
Owner KUNMING UNIV
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