Mask plate and preparation method thereof
A technology of mask plate and area, which is applied in the direction of vacuum evaporation plating, coating, electric solid device, etc., can solve the problems of poor driving backplane, mask plate and driving backplane motherboard, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0038] refer to figure 2 , shows a schematic structural diagram of a mask according to Embodiment 1 of the present invention. The mask plate 20 can be used to prepare the driving backplane motherboard 10 through the evaporation process. In practical applications, the mask plate 20 can be used to prepare the driving backplane display in the driving backplane motherboard 10 through the evaporation process. area. refer to figure 1 , the drive backplane motherboard 10 includes: a backplane area 11 , a transition area 12 between the backplane areas 11 , and an edge area 13 surrounding the backplane area 11 and the transition area 12 . Wherein, a plurality of driving backplanes 111 are arranged in an array in the backplane area 11 .
[0039] like figure 2 As shown, the mask plate 20 includes: a first area 21 corresponding to the edge area 13, and a second area 22 corresponding to the transition area 12, that is, when the mask plate 20 is connected to the drive backplane mother...
Embodiment 2
[0057] refer to Figure 7 , shows a flow chart of steps of a method for preparing a mask according to Embodiment 2 of the present invention. The mask plate is used to prepare a driving backplane mother board through an evaporation process, and the driving backplane mother board includes: a backplane area, a transition area between the back plane areas, and an edge area surrounding the back plane area and the transition area. The method specifically may include the following steps:
[0058] Step 701: Provide a mask substrate; the mask substrate includes a first region corresponding to the edge region, and a second region corresponding to the transition region.
[0059] In this step, firstly, a mask substrate may be provided, and optionally, the mask may be INVAR (Invar, a nickel-iron alloy containing 35.4% nickel). The reticle substrate may include a first region corresponding to the edge region, and a second region corresponding to the transition region.
[0060] Step 702: ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


