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Preparation method of bulk single crystal copper

A single crystal copper and bulk technology is applied in the field of preparation of metal single crystal materials, which can solve the problems of complex preparation process and high cost of high-purity single crystal copper, and achieve the effects of easy large-scale promotion, low cost and simple process.

Active Publication Date: 2021-03-26
嘉兴固美科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a new non-melting method for the preparation of large bulk single crystal copper, aiming to solve the problems of complex preparation process and high cost of bulk high purity single crystal copper in the prior art

Method used

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  • Preparation method of bulk single crystal copper
  • Preparation method of bulk single crystal copper
  • Preparation method of bulk single crystal copper

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Embodiment

[0026] combine Figure 1 to Figure 4 , to describe this embodiment in detail. A kind of preparation method of bulk single crystal copper involved in the present embodiment, comprises the following steps:

[0027] (1) The polycrystalline copper blank is annealed at a high temperature below the melting point to obtain polycrystalline copper with equiaxed grains; the purity of the used polycrystalline copper blank is 99.9999%.

[0028] In this step, the polycrystalline copper billet after pickling and drying is subjected to high-temperature annealing in a vacuum furnace, and the pressure in the furnace is lower than 1×10 -3 Pa, the temperature is raised to 950-1000°C within 80-90min, and the annealing time is 10 hours.

[0029] (2) Extruding the polycrystalline copper blank with equiaxed grains annealed in step (1) to obtain polycrystalline copper aggregates. The cross-section of the polycrystalline copper aggregate can be circular, oval, regular polygon, etc. In this example...

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Abstract

The invention discloses a preparation method of bulk single crystal copper, and the method comprises the following steps of: (1) carrying out high-temperature annealing treatment on a polycrystallinecopper blank below a melting point to obtain equiaxed grain polycrystalline copper; (2) carrying out extrusion molding on the equiaxed grain polycrystalline copper blank annealed in the step (1) to obtain a polycrystalline copper assembly; and (3) carrying out annealing treatment on the polycrystalline copper assembly subjected to extrusion molding in the step (2) again at a high temperature to obtain the bulk single crystal copper. According to the preparation method of the bulk single crystal copper, large-size single crystal copper is prepared through a non-melting method. According to themethod, pre-extrusion treatment is utilized, and then high-temperature annealing is carried out to prepare the bulk single crystal copper bar. The method is simple in process, easy to control, low incost and easy to popularize on a large scale.

Description

technical field [0001] The invention relates to the field of preparation of metal single crystal materials, in particular to a preparation method of bulk single crystal copper. Background technique [0002] Grain boundary is the interface between grains with the same structure but different orientations. At the grain interface, the atomic arrangement transitions from one orientation to another, so the atomic arrangement at the grain boundary is in a transition state. [0003] The interface between grains and grains is called grain boundary. Inorganic non-metallic materials are sintered from fine powder. During sintering, a large number of fine particles form a large number of crystallization centers. Grain boundaries are formed when they develop into grains and grow until they meet. Because of the removal of grain boundaries, single crystal copper has excellent electrical properties, signal transmission properties, machining and fatigue resistance, and is mainly used in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B1/02C30B1/12C30B29/02C21D9/00C22F1/02C22F1/08C25F3/22
CPCC21D9/0075C22F1/02C22F1/08C25F3/22C30B1/02C30B1/12C30B29/02
Inventor 陈斌李鹤赵峰
Owner 嘉兴固美科技有限公司
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