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Intelligent insole, preparation method thereof and foot pressure monitoring system

A technology of smart insoles and hollow parts, applied in the field of flexible wear, can solve the problems of long-term high-precision sensing, elastic modulus, low flexibility, and affecting wearing comfort, and achieve low elastic modulus and capacitance Low relative rate of change and the effect of increasing the pressure range

Active Publication Date: 2021-03-30
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sensor materials used generally have a large elastic modulus and low flexibility, resulting in low comfort of the insole, which greatly affects the wearing comfort.
In addition, the stability of traditional smart insoles is low, and after many cycles, the test results vary greatly, making it difficult to achieve long-term high-precision sensing

Method used

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  • Intelligent insole, preparation method thereof and foot pressure monitoring system
  • Intelligent insole, preparation method thereof and foot pressure monitoring system
  • Intelligent insole, preparation method thereof and foot pressure monitoring system

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0062] The preparation method of the smart insole of an embodiment, comprises the steps:

[0063] Step S110: making a first circuit board and a second circuit board, the first circuit board is provided with a plurality of first solder joints and wires for connecting the first solder joints, and the second circuit board is provided with a plurality of second solder joints point and a second wire for connecting to the second pad.

[0064] Wherein, both the first circuit board and the second circuit board are flexible circuit boards. For example, the material of the first circuit board and the second circuit board is PI or PET. Specifically, the thickness of the first circuit board is 0.1mm˜0.5mm. The thickness of the second circuit board is 0.1mm˜0.5mm.

[0065] In the first circuit board, the number and distribution of the first solder joints are related to the number and distribution of the array units in the sensor. The number of array units in the sensor determines the sp...

Embodiment 1

[0097] The structure of the smart insole of this embodiment is as image 3 As shown, it includes a first circuit board, a fill layer, a sensor and a second circuit board. Wherein, the sensor includes 9 array units, and each array unit includes a first electrode, a dielectric layer and a second electrode. The material of the filling layer is 3M VHB tape.

[0098] The preparation process of the smart insole of the present embodiment is as follows:

[0099] (1) The 3M VHB adhesive tape with 9 hollow parts corresponding to the first FPC circuit board is used as the filling layer, which is used for positioning the sensor on the first FPC circuit board, and is bonded to the first FPC circuit board, 9 The first hollow part hollows out the first solder joint on the first circuit board of the FPC.

[0100](2) A first electrode, a dielectric layer and a second electrode are sequentially formed at the hollow part to obtain a sensor composed of 9 array units. The specific steps are as...

Embodiment 2～ Embodiment 9

[0103] The structure and preparation process of the smart insoles of Examples 2 to 9 are similar to those of the smart insoles of Example 1, except that the material and thickness of the dielectric layer are different. The materials and thickness data of the dielectric layers in Examples 2 to 9 are shown in Table 1 below.

[0104] The material and the thickness of the dielectric layer of the embodiment of table 1

[0105] Example Mass ratio of PDMS precursor and curing agent Dielectric layer thickness / μm Example 2 20∶1 426 Example 3 20∶1 692 Example 4 20∶1 1270 Example 5 20∶1 1841 Example 6 10∶1 692 Example 7 15∶1 692 Example 8 20∶1 692 Example 9 30∶1 692

[0106] The following is the test part:

[0107] 1. Elastic modulus test

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Abstract

The invention relates to an intelligent insole, a preparation method thereof and a foot pressure monitoring system. The intelligent insole comprises a first circuit board, a filling layer, a sensor and a second circuit board which are stacked in sequence. The first circuit board is provided with a plurality of first welding spots and first wires used for being connected with the first welding spots. The filling layer is provided with a plurality of spaced hollow parts, and at least one first welding spot is arranged at the position, corresponding to each hollow part, of the first circuit board; the sensor comprises a plurality of array units which are arranged at intervals, each array unit is arranged in a hollow part, each array unit comprises a first electrode, a dielectric layer and a second electrode which are stacked in sequence, and the first electrode and the second electrode are made of ionic gel; the second circuit board is provided with a plurality of second welding spots andsecond wires used for being connected with the second welding spots. The intelligent insole is low in elasticity modulus, high in flexibility and high in stability.

Description

technical field [0001] The invention relates to the field of flexible wear technology, in particular to an intelligent insole, a preparation method thereof and a foot pressure monitoring system. Background technique [0002] With the increasing awareness of people's health monitoring, people's demand for flexible wearable devices in health applications is increasing. As a flexible wearable device, smart electronic insoles can monitor human motion and gait in real time, accurately and dynamically, so as to achieve the purpose of monitoring human health. At present, the existing smart insoles are mainly based on resistive or capacitive sensing, most of which have real-time monitoring, low cost, and dynamic monitoring of motion signals and other functions. However, the sensor materials used generally have a large elastic modulus and low flexibility, resulting in low comfort of the insole, which greatly affects the wearing comfort. In addition, the stability of traditional sma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A43B17/00A43B17/02A61B5/103A61B5/11A61B5/00C08F220/14C08F222/20C08K5/435H05K1/11H05K3/40
CPCA43B17/00A43B17/02A61B5/1038A61B5/1118A61B5/112A61B5/6807C08F220/14C08K5/435H05K1/11H05K3/4007C08F222/1063
Inventor 彭争春崔杨林洋王海飞
Owner SHENZHEN UNIV
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