Semiconductor process equipment and bearing device

A technology of carrying device and process equipment, which is applied in semiconductor/solid-state device manufacturing, metal material coating process, vacuum evaporation plating, etc. speed, the effect of improving process yield

Active Publication Date: 2021-04-02
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the existing methods, the present application proposes a semiconductor process equipment and its supporting device to solve the technical problem in the prior art that the wafer cooling time is long and the production capacity is too low

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  • Semiconductor process equipment and bearing device
  • Semiconductor process equipment and bearing device
  • Semiconductor process equipment and bearing device

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Embodiment Construction

[0030] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0031] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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PUM

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Abstract

The embodiment of the invention provides semiconductor process equipment and a bearing device thereof. The bearing device is arranged in a process chamber of semiconductor process equipment, is used for bearing and cooling a wafer, and comprises a base and an insulating ring arranged on the periphery of the base in a sleeving manner; a gas flow channel structure is arranged on the upper surface ofthe base, the gas flow channel structure extends in the radial direction and the circumferential direction of the base and extends to the periphery of the base, and the gas flow channel structure isused for introducing cooling gas so as to cool the wafer borne on the upper surface of the base; and the insulating ring is used for limiting the position of the wafer, and a flow guide structure is arranged on the insulating ring and/or the base, communicates with the gas flow channel structure and is used for guiding cooling gas to adjust the exhaust rate of the upper surface of the base. According to the embodiment of the invention, the wafer is cooled in real time, so that the wafer can continuously execute the process, and the productivity of semiconductor process equipment is greatly improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment and a carrying device. Background technique [0002] At present, plasma equipment is widely used in manufacturing processes such as semiconductor chip manufacturing, packaging, light emitting diode (Light Emitting Diode, LED) and flat panel display. In the current manufacturing process, the types of plasma equipment that have been used include: DC discharge type, capacitively coupled plasma (Capacitively Coupled Plasma, CCP) type, inductively coupled plasma (Inductively Coupled Plasma, ICP) type and electron cyclotron resonance plasma ( (Electron Cyclotron Resonance, ECR) and other types. At present, these types of discharges are widely used in semiconductor processes such as physical vapor deposition (Physical Vapor Deposition, PVD), plasma etching, and plasma chemical vapor deposit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/50C23C14/54C23C14/02H01L21/67H01L21/683
CPCC23C14/50C23C14/541C23C14/022H01L21/67248H01L21/683
Inventor 徐奎刘学滨朱磊
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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