Unlock instant, AI-driven research and patent intelligence for your innovation.

Memory system, memory controller and memory chip

A storage chip and storage block technology, applied in the fields of storage systems, storage controllers and a storage chip, can solve the problems of low efficiency of the storage system 10 and the like

Pending Publication Date: 2021-04-06
ETRON TECH INC
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the prior art can reduce 4 clock delays (for example, to 3.5 clock delays) by optimizing the storage system 10, the serial serial-to-parallel conversion procedure performed by the above-mentioned serial-parallel circuit 23 and the above-mentioned parallel-serial circuit 314 perform The serial-to-serial conversion process requires extra power, transmission delay and die areas, resulting in low efficiency of the memory system 10

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Memory system, memory controller and memory chip
  • Memory system, memory controller and memory chip
  • Memory system, memory controller and memory chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0063] Please refer to image 3 , image 3 is a schematic diagram of the storage system 100 disclosed in the first embodiment of the present invention. Such as image 3 As shown, the storage system 100 includes a memory 101 and a logic circuit 102, wherein the memory 101 may be a dynamic random access memory (Dynamic Random Access Memory, DRAM), a static random access memory (Static Random Access Memory, SRAM), a flash memory, or other memory, the logic circuit 102 may be an artificial intelligence chip, or a system-on-a-chip (System on a Chip, SOC). In addition, in an embodiment of the present invention, the memory 101 may include a base DRAM chip (base DRAM chip) and a plurality of DRAM chips stacked on the base DRAM chip. In addition, the logic circuit 102 can be coupled to other devices or processors through an Advanced Extensible Interface bus, wherein the Advanced Extensible Interface bus is a bus protocol, and the bus protocol is an advanced microprocessor bus archit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a memory chip, a memory controller and a memory system. The memory chip includes a memory block, an input / output data bus, and a plurality of first sense amplifiers. The plurality of first sense amplifiers are used for outputting a plurality of first data in parallel. A width of the input / output data bus is equal to a width of the plurality of first data output in parallel by the plurality of first sense amplifiers. Therefore, compared with the prior art, the power consumption, the access delay and the area of the memory chip can be reduced, and the reading / writing window tolerance of the memory chip can be improved.

Description

technical field [0001] The invention relates to a storage system, a storage controller and a storage chip, in particular to a storage system and a storage chip capable of parallel transmission of data between a logic circuit and the storage chip. Background technique [0002] Today, memory systems used in high-performance computing or artificial intelligence systems typically include dynamic random access memory chips and logic circuits. Due to the stack structure of the DRAM chip, the size of the DRAM chip cannot keep up with the size of the logic circuit. Therefore, a memory-wall effect occurs, resulting in a decrease in the data transfer rate between the logic circuit and the DRAM chip. In order to overcome the storage wall effect, the prior art usually uses a faster data rate (for example, from double data rate three (DDR3) to double data rate fourth (DDR4) or double data rate fifth (DDR5)) in the transfer data between the dynamic random access memory chip and the logi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G11C7/06G11C7/10H03M9/00
CPCG11C7/06G11C7/1051G11C7/1078H03M9/00G06F13/1678G11C2207/107G11C2207/108G11C11/4096G11C11/4091G11C7/1012G11C7/106G11C7/1066G11C7/1087G11C7/1093G11C11/4093
Inventor 夏浚
Owner ETRON TECH INC