Temperature control device of electronic device

Abstract

The invention provides a temperature control device of an electronic device. The temperature control device comprises: the electronic device arranged on a heat conduction part; a first thermosensitive element and a second thermosensitive element which are connected with the heat conduction part; a first heat dissipation element, wherein the first heat dissipation element and the first thermosensitive element are arranged at an interval in an initial state, when the heat conduction part reaches a first temperature, the first thermosensitive element deforms, the first heat dissipation element is in contact with the first thermosensitive element, and when the temperature is lower than the first temperature, deformation is recovered, and the first heat dissipation element is separated from the first thermosensitive element; and a second heat dissipation element, wherein the second heat dissipation element and the second thermosensitive element are arranged at an interval in an initial state, when the heat conduction part reaches a second temperature, the second thermosensitive element deforms, the second heat dissipation element is in contact with the second thermosensitive element, and when the temperature is lower than the second temperature, deformation is recovered, the second heat dissipation element is separated from the second thermosensitive element, and the second temperature greater than the first temperature. When the temperature of the electronic device is controlled, electric drive is not needed, the risk of overload failure is avoided, and power loss is avoided.

Description

technical field [0001] The invention relates to the technical field of temperature control of electronic devices, in particular to a temperature control device of electronic devices. Background technique [0002] The semiconductor materials of lasers used in optical communication are mainly indium phosphide and gallium arsenide. The semiconductor devices in lasers are easily affected by temperature, resulting in temperature drift, which causes the emission center wavelength of the laser to drift to long wavelengths. In order to control the wavelength drift, the traditional solution usually adds a semiconductor cooling chip and an electric drive chip to the semiconductor laser. The temperature of the laser is controlled, which indirectly controls the wavelength shift. In the system, the semiconductor refrigerator has the problem of maximum cooling power (maximum heating power). Once overloaded, the device including the system will fail. At the same time, the introduction of ...

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Problems solved by technology

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the defects of overload failure, system power consumption and cost increase in the prior art when controlling the temperature of electronic devices, thereby providing a temperature control device for electronic devices

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