Micro-system packaging shell with heterogeneous integrated double-sided cavity structure and manufacturing method

Abstract

The invention relates to a micro-system packaging shell with a heterogeneous integrated double-sided cavity structure and a manufacturing method. The micro-system packaging shell comprises a shell body, a metal bottom plate is installed in the middle of the shell body, the shell body forms the double-sided cavity structure, the micro-system packaging shell also comprises an upper metal frame and a lower metal frame, the middle of the metal bottom plate is hollow, and amultilayer ceramic substrate is embedded in the hollow; cavities are formed in the surface and the bottom surface of the multilayer ceramic substrate; the upper metal frame and the lower metal frame form sealing between the multilayer ceramic substrate and the metal bottom plate; a substrate step structure is arranged at the edge of the multilayer ceramic substrate, a bottom plate step structure is also arranged at the hollow edge of the metal bottom plate, and the substrate step structure is matched with the bottom plate step structure; a through hole is formed in the multilayer ceramic substrate, a step is arranged in the through hole, and an SMP glass insulator is embedded in the through hole; notches are formed in the side walls of the upper metal frame and the lower metal frame, and ceramic insulators are embedded into the notches. Multi-chip airtight packaging can be realized, the microwave performance is good, and the reliability is high.

Description

technical field [0001] The invention relates to a microsystem packaging shell with a heterogeneously integrated double-sided cavity structure and a manufacturing method, belonging to the field of heterogeneously integrated three-dimensional packaging shells. Background technique [0002] In order to meet the requirements of miniaturization, intelligence and networking of low-power, high-performance computing, communication and control devices, it is necessary to integrate more and more functions into smaller and smaller device spaces when designing circuits. Among them, it is required to integrate and package more circuits with different functions in a miniaturized box. The use of a three-dimensional integrated packaging structure is a good solution to the above problems, that is, on the basis of the traditional two-dimensional transmission structure circuit, the vertical radio frequency transmission channel is added to realize the three-dimensional packaging of the circuit ...

AI Technical Summary

Problems solved by technology

The signal transmission medium of the traditional packaging shell is generally a single material, the signal transmission direction inside the shell is mostly in the direction of one plane, and the cavity structure of the packaged chip is a single-sided cavity structure, so there is an urgent need for a shell that can meet the needs of three-dimensional packaging and multi-dimensional packaging. Requirements for mixed integration of various materials

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