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Waterproof wafer-level package method aiming at glass-silicon-glass sandwich structure

A wafer-level packaging and sandwich technology, which is applied to reduce the impact of water flow, and achieves the effect of preventing the impact of water flow, and the size and depth of the structure are precisely controllable.

Active Publication Date: 2014-05-21
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Abstract
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  • Waterproof wafer-level package method aiming at glass-silicon-glass sandwich structure
  • Waterproof wafer-level package method aiming at glass-silicon-glass sandwich structure
  • Waterproof wafer-level package method aiming at glass-silicon-glass sandwich structure

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Embodiment Construction

[0037] In order to prevent the scribing water from flowing into the layout design, there are no graphics and structures within 5mm of the edges of the three wafers during the layout design, so as to ensure that the edges of the wafers can be bonded firmly during the two anodic bonding, and the water will not flow during scribing. It enters the interior of the device from the side of the three-layer wafer stack.

[0038] Control attached figure 1 After the front structure of the silicon-based structure wafer Si is completed, the first anodic bonding is performed with the sealing glass wafer glass1, and the sealing glass wafer glass1 can be used as a supporting substrate for the silicon-based structure 2 of the device. Use the overlay process to register the back and front patterns of the silicon wafer, and then perform dry etching and structure release of the chip unit silicon base structure 2 and the wall structure 1, so that the unnecessary silicon base is etched away, and the ...

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Abstract

The invention provides a waterproof wafer-level package method aiming at a glass-silicon-glass sandwich structure. The method at least comprises the following steps: adding or reducing three types of auxiliary structures in a layout design so as to realize a sandwich sealed package structure; adding a silicon-based fence structure at the periphery of a low-resistance silicon-based chip unit; outwardly extending a lead wire segment from each bonding pad lead wire structure to the inner side of a fence; respectively adding one lead wire segment at the periphery of the outer side of the fence, and respectively extending two ends of each lead wire segment to the outer side of the mutual adjacent fence; electrically connecting all the lead wire bonding pad structures of the chip unit by utilizing the low-resistance characteristic of the fence; realizing the ohmic contact of lead wires and a silicon base through anodic bonding and realizing the three-layer structure stacking of the silicon-based structure and glass wafers; and detaching the added structures through scribing, splitting and other means. The method has the following advantages: the processing difficulty or steps are not increased; the original functional structure of a device is not damaged; signals are led out from a bonding interface, and water inflow does not exist during scribing; the wafer-level sealed package of the sandwich structure is realized; and the process is simplified, the package cost is low and the rate of finished products is high.

Description

technical field [0001] The present invention relates to a new type of waterproof wafer-level packaging method aimed at glass-silicon-glass "sandwich" structure, ingeniously designing the increase and decrease of auxiliary structures on the layout of the original structure of the device, so as to realize the signal extraction from the bonding interface , and prevent the scribing water flow from penetrating and damaging the internal movable structure of the MEMS device, which belongs to the technical field of multilayer MEMS wafer level packaging, and is widely used in the packaging of MEMS devices containing movable structures or multilayer stacking integration. Background technique [0002] The glass-silicon-glass "sandwich" structure wafer-level packaging technology is mainly realized based on anodic bonding technology, that is, the silicon substrate is directly sealed with the upper and lower two Pyrex7740 glasses through electrostatic bonding without any adhesive . The s...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00B81C3/00
Inventor 朱健吴璟刘梅石归雄
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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