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Novel circuit board ink windowing method

A circuit board and ink technology, which is applied in the secondary processing of printed circuits, coating non-metallic protective layers, etc., can solve problems such as inability to guarantee ink bridges

Pending Publication Date: 2021-04-20
信丰迅捷兴电路科技有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, ink bridges between pads cannot be guaranteed using traditional fabrication processes

Method used

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  • Novel circuit board ink windowing method

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0023] Such as figure 1 As shown, one embodiment of the present invention discloses a novel circuit board ink window opening method, comprising the following steps:

[0024] S1: Pre-treatment of solder resistance: make the circuit board lamp face down and enter the board along the length direction, use volcanic ash grinding plate, the grinding plate parameter is 2.5m / min; the grinding mark control is 6mm; the spray pressure is 1.2 / bar to remove the pollutants on the board surface And copper surface oxidation, synchronously roughened copper surface enhances ink adhesion;

[0025] S2: Ink infiltration: Ink infiltration is performed on both sides of the substrate respectively to complete ink printing;

[0026] S3: Baking: Baking the surface of the substrate that has been infilt...

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Abstract

The invention discloses a novel circuit board ink windowing method, and relates to the technical field of printed circuit boards. The method comprises the following steps: performing solder mask pretreatment: cleaning pollutants on a copper surface by using a volcanic ash grinding plate; performing ink infiltration: performing ink infiltration on the two faces of the substrate to complete ink printing; baking: respectively baking the surface of the substrate with the ink infiltrated on the two sides to realize the curing of the ink; and polishing: determining the thickness of the ink on the two sides of the substrate, and respectively polishing the two sides of the substrate once along the length direction of the substrate by adopting two groups of 600-mesh ceramic brush wheels, two groups of 800-mesh thermosetting resin foaming non-woven fabric brush rollers and a group of 1200-mesh non-woven fabric brush rollers. The traditional solder resist ink manufacturing process is abandoned, the solder resist exposure and development processes are replaced by removing the surface bonding pad ink in a ceramic polishing manner, and the windowing effect is achieved. The IC solder-resisting bridge technology which cannot meet the requirement that the distance between circuit bonding pads is smaller than or equal to 0.075 mm in a traditional mode can be achieved, and it is guaranteed that ink between bridges is free of lateral erosion and cracks and cavities.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a novel ink window opening method for circuit boards. Background technique [0002] The solder mask refers to the part of the printed circuit board that needs to be covered with green oil. Its main function is to protect the surface conductor from being exposed to the air to cause oxidation and scratches, and to prevent solder paste from being connected to the pad when it is printed. Short circuit, and the "solder resistance bridge" is the green oil between one window of the component to another window is the solder resistance bridge, mainly to prevent the short circuit risk of adjacent IC tin flow. [0003] For PCB board factories, the ability to produce solder mask bridges is to control the amount of ink side erosion. Different ink colors have different production difficulties and capacity requirements. The most difficult black matte ink side erosion is currently...

Claims

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Application Information

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IPC IPC(8): H05K3/28
Inventor 陈强杜林峰吉勇林清赞陈定成
Owner 信丰迅捷兴电路科技有限公司
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