Manufacturing method of touch screen metal wire

Abstract

The invention discloses a manufacturing method of a touch screen metal wire, which comprises the following steps of: a, sputtering a first Mo layer, a middle Al layer and a second Mo layer on a glasssubstrate in sequence by taking argon as working gas; b, etching the sputtered Mo-Al-Mo layer by adopting a nitric acid-phosphoric acid-acetic acid system etching solution, wherein the mass percent ofthe nitric acid is 8-11%, and when the first Mo layer and the second Mo layer are sputtered, oxygen is respectively introduced into the sputtering system, the oxygen introduction amount during sputtering of the second Mo layer is equal to the oxygen introduction amount during sputtering of the second Mo layer. When the first Mo layer and the second Mo layer are sputtered respectively, oxygen is introduced into the sputtering system, the oxygen introduction amount in the sputtering system when the first Mo layer and the second Mo layer are sputtered is controlled, and the mass percent of nitric acid-phosphoric acid-acetic acid system etching liquid is controlled, so that the structure of the obtained metal wire has no undercut phenomenon, and the climbing effect is very good.

Description

technical field [0001] The invention relates to the field of touch screen manufacturing, in particular to a method for manufacturing a touch screen metal wire. Background technique [0002] With the emergence of various new structures of touch screens, the requirements for overlapping between film layers are getting higher and higher, and the width of metal lines is also getting smaller and smaller, so the requirements for the slope angle of metal lines are becoming more and more stringent. [0003] In the touch screen manufacturing process, the Mo-Al-Mo structure is usually used to make the edge metal line, the middle Al layer plays the role of conduction, the second Mo layer on the upper layer plays the role of protecting the middle Al layer, and the first Mo layer on the lower layer acts Increase the adhesion to the substrate. After the Mo-Al-Mo layer is sputtered sequentially, it is etched with an etching solution, and the final product formed is as follows: figure 1 T...

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Problems solved by technology

[0004] However, in fact, since the activity of the Al element is higher than that of Mo, the etching rate of the middle Al layer is faster than that of Mo. On the other hand, the first Mo layer needs a certain amount of oxygen because it needs stronger adhesion to the substrate. , the etching rate of the first Mo layer after oxygen flow is higher than that of the second Mo layer without oxygen flow, which eventually leads to the undercut (Undercut) phenomenon of the middle Al layer after etching and the protruding metal side etching of the second Mo layer ,like figure 2 As shown, the structure of the metal wire is roughly an inverted trapezoidal structure

For metal wires with an undercut structure, during the post-production process, the second Mo layer on the upper layer is prone to breakage, forming metal wires and causing a short circuit between the metal wires. At the same time, due to the residual air in the first Mo layer on the lower layer, Applying glue on its film layer will cause glue repulsion

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