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Perovskite solar cell device and packaging method thereof

A technology of solar cells and packaging methods, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve problems such as poor stability, and achieve the effects of overcoming poor stability, reducing damage, and inhibiting decomposition reactions

Active Publication Date: 2021-04-23
EZHOU INST OF IND TECH HUAZHONG UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The invention provides a perovskite solar cell device and its packaging method to solve the problem of poor stability of perovskite solar cell devices in the prior art under the combined action of high temperature (65-85°C) and light

Method used

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  • Perovskite solar cell device and packaging method thereof
  • Perovskite solar cell device and packaging method thereof
  • Perovskite solar cell device and packaging method thereof

Examples

Experimental program
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Effect test

specific Embodiment 1

[0076] (1) Prepare perovskite solar cells on transparent conductive glass. The structure of the cell adopts the pin type trans structure "transparent conductive layer / hole transport layer / perovskite / electron transport layer / buffer layer / metal electrode" FTO / NiO / FA 0.85 Cs 0.15 Pb(I 0.95 Br 0.05 ) 3 / PCBM / BCP / Ag structure.

[0077] (2) The cover plate is hot-pressed and packaged (there is a cavity structure between the cover plate and the battery), and a layer of Pyraline C with a thickness of 300nm is deposited first, and then the cover plate is hot-pressed and bonded without gaps (note: the cover plate There is no cavity structure between the board and the Paralyne C film layer), sequentially deposit a layer of 300nm thick Paralyne C / evaporate a layer of 50nm thick MgF 2 / Deposit a layer of 40nm-thick aluminum oxide back cover plate hot-pressed gap-free bonding package (note: there is no cavity structure between the cover plate and the aluminum oxide film layer), seque...

specific Embodiment 2

[0084] (1) Prepare perovskite solar cells on transparent conductive glass. The structure of the cell adopts the pin type trans structure "transparent conductive layer / hole transport layer / perovskite / electron transport layer / buffer layer / metal electrode" FTO / NiO / FA 0.85 Cs 0.15 Pb(I 0.95 Br 0.05 ) 3 / PCBM / BCP / Ag structure.

[0085] (2) Use UV glue cover plate for gap-free bonding package, first deposit a layer of 300nm-thick Paralin C, then UV glue cover plate for gap-free bonding package, and then deposit a layer of 300nm-thick Paraline C / Evaporate a layer of 50nm thick MgF 2 / After depositing a layer of 40nm thick aluminum oxide, the UV glue cover plate is bonded and packaged without gaps, and sequentially deposits a layer of 300nm thick paraffin C / evaporates a layer of 50nm thick MgF 2 / Deposit a layer of 40nm thick aluminum oxide as a multi-layer thin film packaging method to prepare perovskite solar cell devices. Pay attention to the lead-out part of the prote...

specific Embodiment 3

[0089] (1) Prepare perovskite solar cells on transparent conductive glass. The structure of the cell adopts the pin type trans structure "transparent conductive layer / hole transport layer / perovskite / electron transport layer / buffer layer / metal electrode" FTO / NiO / FA 0.85 Cs 0.15 Pb(I 0.95 Br 0.05 ) 3 / PCBM / BCP / Ag structure.

[0090] (2) On the surface of the battery, first use chemical vapor deposition of 300nm thick Paralin C, and then evaporate a layer of 50nm thick MgF 2 Increase its surface wettability, and finally use ALD to deposit a layer of aluminum oxide to form an inert barrier film package. Pay attention to the lead-out part of the protective electrode wire, and it cannot be covered by the inert layer to affect the subsequent charge export.

[0091] (3) After the film is packaged, the cover plate is bonded and packaged without gaps. The glass cover plate is tightly bonded to the battery plate through ultraviolet curing glue, and after being cured by ultraviolet...

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Abstract

The invention relates to the field of perovskite solar cell packaging, and provides a perovskite solar cell device and a packaging method thereof. The perovskite solar cell device comprises a glass substrate, a perovskite solar cell, an inert barrier layer, a cover plate and a cover plate packaging adhesive; the perovskite solar cell is arranged on the glass substrate, the inert barrier layer is arranged on the perovskite solar cell, and the cover plate is arranged on the inert barrier layer in a gapless fit mode through the cover plate packaging adhesive. According to the perovskite solar cell device and the packaging method thereof provided by the invention, the stability of the perovskite solar cell device under the combined action of high temperature (65-85 DEG C) and illumination can be remarkably improved by adopting a combined packaging mode of firstly packaging the inert barrier layer and then packaging the rear cover plate in a gapless fit manner.

Description

technical field [0001] The invention relates to the technical field of perovskite solar cell packaging, and more specifically, to a perovskite solar cell device and a packaging method thereof. Background technique [0002] Photovoltaic technology is a technology that directly converts light energy into electrical energy. Perovskite solar cells are a new type of third-generation solar cell. The efficiency of small-area devices in the laboratory has been improved in just 11 years since its development in 2009. Compared with crystalline silicon solar cells that occupy 90% of the market, the cost of perovskite solar energy is relatively lower, and the efficiency is also very close to the certified efficiency record of crystalline silicon cells. The main technical bottleneck currently facing is the battery. long-term stability. [0003] There are many reasons for the stability of perovskite solar cells. First, the crystallization temperature of most organic-inorganic hybrid hal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/44H01L51/48
CPCH10K30/88Y02E10/549
Inventor 陈炜刘宗豪周静
Owner EZHOU INST OF IND TECH HUAZHONG UNIV OF SCI & TECH
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