Bus capacitor structure and elevator inverter

Abstract

The invention relates to a busbar capacitor structure and an elevator frequency converter. The busbar capacitor structure includes a positive electrode copper bar and a negative electrode copper bar; it also includes: a circuit board, a positive electrode metal foil arranged on one side of the circuit board and a negative electrode metal foil arranged on the other side of the circuit board; a busbar capacitor die set on the circuit board The group includes two capacitor modules connected in series; the capacitor module includes a positive bus bar capacitor unit and a negative bus bar capacitor unit connected in parallel, and the positive bus bar capacitor unit includes a current input terminal connected to the positive copper bar through the positive metal foil, and the current output terminal connected through the negative metal foil. A plurality of busbar capacitors of the negative electrode copper bar, the negative electrode busbar capacitor unit includes a plurality of busbar capacitors whose current output terminal is connected to the negative electrode copper bar through the negative electrode metal foil, and the current input end is connected to the positive electrode copper bar through the positive electrode metal foil. The busbar capacitor structure of the present application reduces the installation tolerance, realizes the miniaturization of the busbar capacitor structure, and effectively eliminates the parasitic inductance of the loop and the parasitic inductance caused by the current flowing through the copper bar.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to a busbar capacitor structure and an elevator inverter. Background technique [0002] Existing elevator inverter bus capacitors use a number of bulky bolt-type electrolytic capacitors. The electrodes of the bolt capacitors are connected to the copper plate above by fasteners. The copper plate is divided into upper and lower layers, and the two layers are separated and combined by insulating materials. into an assembly. The huge bolt-type bus capacitors and copper plates make it impossible to miniaturize the elevator inverter products. At the same time, the design of the integrated copper plate with stacked insulation and isolation is adopted, which is costly. The lead terminals at the left and right ends of the copper plate are connected to the input and output sides of the elevator inverter. IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) po...

AI Technical Summary

Problems solved by technology

Huge bolt-type busbar capacitors and copper plates make it impossible to miniaturize elevator inverter products. At the same time, the copper plate design with stacked insulation and isolation is adopted, which is costly; the lead-out terminals at the left and right ends of the copper plate are connected to the input and output sides of the elevator inverter. The IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) power module, because there are many positioning screw holes in the power module, the accumulated tolerance is large, and the tolerance is finally accumulated on the bolted electrolytic capacitor mounting hole in the middle of the copper plate. Affected by mechanical stress, it is not only inconvenient to install, but also affects the performance and life of the capacitor, resulting in a decline in the performance of elevator inverter products

[0003] In the process of implementation, the inventors found that there are at least the following problems in the traditional technology: the existing elevator inverter bus capacitor is bulky, the tolerance of the production and installation process is large, and the parasitic inductance of the copper plate cannot be effectively eliminated, which affects the performance and life of the capacitor.

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