Nano whisker modified epoxy resin composition

An epoxy resin and nano-whisker technology is applied in the field of thermosetting plastics and epoxy plastic packaging materials for electronic and electrical packaging, which can solve problems such as reduced fluidity and achieve the effect of improving strength

Inactive Publication Date: 2021-04-30
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This patent solves the fluidity reduction caused by the addition of nano-whiskers, so that there is no obstacle to the introduction of this raw material into epoxy molding compound

Method used

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  • Nano whisker modified epoxy resin composition
  • Nano whisker modified epoxy resin composition
  • Nano whisker modified epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6

[0075] The preparation method of embodiment 1-6,11,12 comprises the steps:

[0076] 1) After each component is accurately weighed, epoxy resin, phenolic resin and additives are mixed and pulverized;

[0077] 2) adding the nano whiskers and the inorganic filler to the coupling agent in turn and stirring in a high-speed mixer;

[0078] 3) Add the pulverized resin powder into a high-speed mixer and stir;

[0079] 4) mixing and processing for 10 minutes on a two-roller mill;

[0080] 5) Cool, pulverize and test.

Embodiment 12

[0110] In Example 12, the proportion of whiskers added is small, which has little effect on the overall fluidity; in Example 11, the proportion of whiskers added is relatively large, and good fluidity can also be achieved through the proportion of resin.

[0111] In a word, it shows that the solution of the present invention to solve the decrease in fluidity is effective.

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Abstract

The invention provides a nano whisker modified epoxy resin composition. The composition comprises the following components in parts by weight: 2-25 parts of epoxy resin A; 2-25 parts of a curing agent B; 0-15 parts of nano crystal whisker C; 0.01-3 part of an accelerant D; 15-89 parts of an inorganic filler E; 0-25 parts of a flame retardant F; 0.05-3 part of a release agent G; 0.01-3 part of a coupling agent H; 0-3 parts of a modifier I. The composition has the following technical effects: 1) compared with a material without nano whisker, the strength is obviously improved; the composition is especially suitable for electronic packaging, and can also be used for packaging some small electrical appliances or manufacturing structural members. 2) More than 5% of nano whiskers are added in the embodiment of the common epoxy molding compound, the system fluidity is greatly reduced, and the spiral flow length is reduced by more than 20cm and the actual availability of the formula is reduced, the defect is avoided through the technical means, the overall spiral flow length is generally more than 30cm, and the overall spiral flow length of the low-stress product can be more than 80cm.

Description

technical field [0001] The epoxy resin composition involved in the present invention belongs to the technical field of thermosetting plastics, and further belongs to the technical field of epoxy molding compound for packaging electronic appliances. Background technique [0002] In the integrated circuit industry, it is necessary to fix and protect the chip with insulating plastic or ceramic materials, and undertake the functions of supporting and conducting heat, which is called "packaging". Most of the packaging materials now use epoxy molding compound. Epoxy molding compound is a powder molding compound made of epoxy resin as matrix resin, high-performance phenolic resin as curing agent, silicon micropowder as filler, and various additives. It is an epoxy resin composition. [0003] Whiskers are grown in the form of single crystals, a kind of fiber grown in the form of fibrous (whisker-like) single crystals with uniform cross-section, complete shape, and perfect internal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/10C08K7/08C08K3/36C08K7/18C08K3/22C08K13/04C08G59/62
CPCC08L63/00C08G59/621C08K2201/011C08L2203/206C08K2003/2227C08L2205/025C08K7/10C08K7/08C08K3/36C08K7/18C08K3/22C08K13/04
Inventor 王汉杰李刚王善学李海亮卢绪奎李政常治国冯卓星
Owner 江苏中科科化新材料股份有限公司
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