Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Unsealing method of metal ceramic packaged crystal oscillator with chip injection molding packaging

A crystal oscillator and cermet technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low unpacking efficiency and inability to ensure the integrity of the internal structure, achieve high unpacking efficiency, and avoid acid corrosion time. Long-lasting, damage-preventing effect

Pending Publication Date: 2021-04-30
BEIJING ZHENXING METROLOGY & TEST INST
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide a method for unsealing a metal-ceramic packaged crystal oscillator packaged by chip injection molding, so as to solve the problems in the prior art that the integrity of the internal structure cannot be guaranteed and the unsealing efficiency is low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Unsealing method of metal ceramic packaged crystal oscillator with chip injection molding packaging
  • Unsealing method of metal ceramic packaged crystal oscillator with chip injection molding packaging
  • Unsealing method of metal ceramic packaged crystal oscillator with chip injection molding packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] As an embodiment of the present invention, taking the 51099-20MHz crystal oscillator of RAKON Company as an example, the unsealing method of the cermet encapsulated crystal oscillator of the chip injection molding package includes the following steps:

[0061] Step 1. Carry out X-ray inspection on the internal structure of the crystal oscillator to obtain the internal chip installation position of the crystal oscillator, the chip bonding method, the solder joint position of the chip cavity 1, and the chip installation position.

[0062] Step 2. According to the internal information of the crystal oscillator, use the mechanical unsealing method to unseal the wafer cavity 1: use flat pliers to fix the sample, and use a small hand-held grinder to grind the metal cover 101 to a sufficiently thin welding seam , aim the blade at the weld seam after grinding, apply pressure to the blade to insert the blade edge into the weld seam until the cover plate falls off, exposing the wa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an unsealing method of a metal ceramic packaged crystal oscillator with chip injection molding packaging, belongs to the technical field of unsealing of electronic components, and solves the problems that the integrity of an internal structure cannot be ensured, the unsealing efficiency is low and the like in the prior art. The unsealing method of the metal ceramic packaged crystal oscillator with chip injection molding packaging is characterized in that the crystal oscillator comprises a chip cavity and a wafer cavity, and the wafer cavity is arranged on the chip cavity and is connected with the chip cavity through welding spots; the wafer cavity includes a metal cover plate and a lower cavity, and the wafer is arranged in a space formed by the metal cover plate and the lower cavity; a chip and a bonding wire are arranged in the chip cavity through injection molding packaging; and when the chip cavity is unsealed, the injection molding area of the chip cavity is heated by using the outer flame of an alcohol lamp, and then chemical unsealing is carried out by using a corrosive agent. The method is suitable for unsealing the crystal oscillator.

Description

technical field [0001] The invention belongs to the technical field of unsealing of electronic components, in particular to a method for unsealing a metal ceramic package crystal oscillator packaged by chip injection molding. Background technique [0002] Destructive physical analysis and failure analysis are commonly used methods to evaluate the reliability of crystal oscillators. Before performing tests such as internal visual inspection, bond strength and chip defect location, the device is usually required to be de-encapsulated. The quality of device unsealing is directly related to the scientificity and validity of the analysis conclusion, and even the success or failure of the whole experiment. [0003] The commonly used device unsealing methods are: mechanical unsealing, chemical unsealing, laser unsealing, etc. [0004] Due to the structure of this type of crystal oscillator and the particularity of packaging materials, using one or two unpacking methods cannot achi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 许艳君闫玉波李智李文周
Owner BEIJING ZHENXING METROLOGY & TEST INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com