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High-precision, high-efficiency and ultrafast laser processing method for micropores with large depth-diameter ratio

An ultra-fast laser and processing method technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., to achieve the effects of shortening processing time, high processing efficiency, and large depth

Active Publication Date: 2021-05-07
TSINGHUA UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The present invention aims to solve at least one of the technical problems existing in the existing processing technology or related processing technology

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  • High-precision, high-efficiency and ultrafast laser processing method for micropores with large depth-diameter ratio
  • High-precision, high-efficiency and ultrafast laser processing method for micropores with large depth-diameter ratio

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Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0027] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The invention relates to a high-precision, high-efficiency and ultrafast laser machining method for micropores with the large depth-diameter ratio, belongs to the technical field of high-precision intelligent laser manufacturing. A high-precision laser space shaping technology and a high-efficiency process judgment control method are applied to morphology repair of micro-deep through holes, so that the morphology quality and the machining efficiency of the micropores are improved. The method comprises the following steps that a corresponding laser machining technology is set according to material attributes and machining technology requirements; a target material is punched through Gaussian laser; a real-time monitoring device is used for monitoring the target material, and when the target material is penetrated, laser energy distribution is converted into a flat top type from a Gaussian type; morphology repair machining is performed on the micropores by the aid of flat-topped laser; and when the real-time monitoring device monitors that the morphology of the outlet of the micropore meets the requirement, the next micropore is machined. According to the method, Gaussian laser machining and flat-topped laser repairing are combined, the machining mode that the machining process is monitored, fed back and controlled in real time is adopted, and the micropore machining quality and machining efficiency are effectively improved.

Description

technical field [0001] The invention is oriented to a high-precision and high-efficiency ultrafast laser processing method for microholes with a large depth-diameter ratio, and belongs to the technical field of high-precision intelligent laser manufacturing. It applies high-precision laser space shaping technology and high-efficiency process judgment control method to micro-depth channels The shape repair of the hole improves the shape quality and processing efficiency of the microhole. Background technique [0002] Laser micro-nano manufacturing is one of the frontiers and important development directions of mechanical manufacturing technology, providing important technical support for processing and manufacturing in my country's aerospace, national defense, energy, automobile, biology, medical and many other fields. Laser micro-hole manufacturing is the best solution to break through many key core technologies and solve key problems in the above-mentioned industrial fields...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/60B23K26/70
CPCB23K26/382B23K26/60B23K26/70
Inventor 张震杨伟管迎春
Owner TSINGHUA UNIV
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