Electronic equipment heat dissipation device with semiconductor auxiliary heat pump

Abstract

The invention discloses an electronic equipment heat dissipation device with a semiconductor auxiliary heat pump. The electronic equipment heat dissipation device comprises a main heat dissipation fin set, a first heat pipe set, a first heat absorption module and the semiconductor auxiliary heat pump. The first heat pipe group comprises a heat absorption end and a heat dissipation end; the heat absorption end of the first heat pipe set is tightly attached to the heating area of the electronic equipment through the first heat absorption module, and the heat dissipation end of the first heat pipe set is arranged on the main heat dissipation fin set in a penetrating mode. The semiconductor auxiliary heat pump comprises a semiconductor refrigeration unit and a cooling capacity conduction assembly, the semiconductor refrigeration unit is provided with a cold face and a hot face, one part of the cooling capacity conduction assembly is arranged at one end of the cold face and used for absorbing cooling capacity, and the other part of the cooling capacity conduction assembly is arranged on the main cooling fin set or the first heat pipe set and used for transmitting and exchanging the cooling capacity. According to the electronic equipment heat dissipation device with the semiconductor auxiliary heat pump, a low-temperature area can be formed around the heat pipes in the first heat pipe set, condensation and circulation of working media in the heat pipes in the first heat pipe set are promoted, and the working efficiency of the electronic equipment heat dissipation device is improved.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to a heat dissipation device for electronic equipment equipped with a semiconductor auxiliary heat pump. Background technique [0002] Electronic equipment such as central processing unit (CPU) or image processing unit (GPU) will generate a lot of heat during work. If the heat is not dissipated in time, it will seriously reduce its performance and even damage its life. Therefore, improve and optimize the performance of the cooling device. The ability to dissipate heat is becoming more and more important. [0003] At present, the more efficient air-cooled heat dissipation device is the heat pipe fin group heat dissipation device. In this type of device, the two ends of the heat pipe are respectively in contact with the high-temperature heat source and the heat dissipation fin group. Inside the heat pipe, the heat exchange medium undergoes a continuous cycle of...

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Problems solved by technology

[0005] The conventional electronic cooling device composed of cooling fans, cooling fins, and heat pipes in the prior art has the following problems: Due to the limitations of electronic equipment installation space, system noise, fan capacity, and the number of heat pipes, conventional electronic cooling The size and performance of the device have encountered a development bottleneck. When the power of the electronic device exceeds the maximum heat transfer Qmax of the heat pipe, its heat dissipation performance deteriorates rapidly, and the core temperature of the electronic device rises sharply

The current problem is that the heating power of electronic equipment usually has a large range of variation, and it is necessary to equip a semiconductor refrigeration unit that matches the maximum thermal power of the electronic equipment, so the energy consumption of the heat sink is huge; , it also needs to be equipped with a larger volume of air-cooled or water-cooled heat sink; therefore, the purchase cost and use cost are much higher than traditional electronic equipment heat sinks

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