Metal-clad laminate, wiring board, metal foil provided with resin, and resin composition
A resin composition and metal-clad technology, applied in metal layered products, metal pattern materials, coatings, etc., can solve problems such as transmission loss
Active Publication Date: 2021-05-14
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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AI Technical Summary
Problems solved by technology
It is known that these transmission losses are particularly likely to occur when high-frequency signals are transmitted to the wiring provided on the wiring board
Method used
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Embodiment 1～9 and comparative example 1～3
[0236] In this example, each component used when preparing a resin composition is demonstrated.
[0237] (polyphenylene ether compound)
[0238] Modified PPE-1:
[0239] Modified polyphenylene ether obtained by reacting polyphenylene ether with chloromethylstyrene.
[0240] Specifically, it is a modified polyphenylene ether obtained by reacting as follows.
[0241] First, polyphenylene ether (SA90 manufactured by SABIC Innovative Plastics, with 2 terminal hydroxyl groups and a weight-average molecular weight Mw1700) was charged into a 1-liter three-necked flask equipped with a temperature regulator, a stirring device, a cooling device, and a dropping funnel. 200 g, 30 g of a 50:50 mass ratio of p-chloromethyl styrene and m-chloromethyl styrene (chloromethyl styrene manufactured by Tokyo Chemical Industry Co., Ltd.: CMS), 30 g of tetra-n-butylene as a phase transfer catalyst 1.227 g of ammonium bromide and 400 g of toluene were stirred. Then, stirring was performed until th...
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Abstract
One aspect of the present invention is a metal-clad laminate comprising an insulating layer and a metal foil that is in contact with at least one surface of the insulating layer, the insulating layer including a cured product of a resin composition that contains a polyphenylene ether, and the metal foil being such that: a first quantity of elemental nickel measured by X-ray photoemission spectroscopy in a surface on the side of the metal foil that is in contact with the insulating layer is 4.5 at% or less with respect to the total quantity of elements measured by X-ray phtotoemission spectroscopy; and when the surface on the side of the metal foil that is in contact with the insulating layer is sputtered for one minute at a speed of 3 nm / min in terms of SiO2, a second quantity of elemental nickel measured by X-ray photoemission spectroscopy in the aforementioned surface is 4.5 at% or less with respect to the total quantity of elements measured by X-ray photoemission spectroscopy.
Description
technical field [0001] The present invention relates to a metal foil-clad laminate, a wiring board, a resin-coated metal foil, and a resin composition. Background technique [0002] In various electronic devices, along with the increase in the amount of information processing, mounting technologies such as higher integration of mounted semiconductor devices, higher wiring density, and multilayering have been rapidly developed. In addition, as wiring boards used in various electronic devices, for example, wiring boards compatible with high frequencies, such as millimeter-wave radar boards used in automotive applications, are required. [0003] When a signal is transmitted to the wiring included in the wiring board, transmission loss due to conductors forming the wiring, transmission loss due to dielectrics around the wiring, and the like occur. It is known that these transmission losses are particularly likely to occur when high-frequency signals are transmitted to the wirin...
Claims
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IPC IPC(8): B32B15/08H05K1/09
CPCH05K1/09C09D171/12H05K3/022H05K1/0326H05K2201/0355B32B15/08B32B15/20B32B2311/12B32B2371/00B32B2457/08B32B2307/538C08G65/485C08L71/126C08L2203/20
Inventor 有泽达也山口峻佐藤文则入船晃西野充修
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD