Penetration type ultrathin liquid cooling plate integrated with low flow resistance manifold network

Abstract

A penetration type ultrathin liquid cooling plate integrated with a low-flow-resistance manifold network comprises an upper-layer cold plate, a middle-layer cold plate, a lower-layer cold plate and a cover plate which are sequentially arranged from top to bottom, and cooling liquid flow channels of the upper-layer cold plate, the middle-layer cold plate and the lower-layer cold plate are communicated with one another; cooling liquid flows into an input manifold flow channel of the lower-layer cold plate from a cooling liquid inlet of the lower-layer cold plate, flows into a heat dissipation unit flow channel of the upper-layer cold plate through an input through hole of the middle-layer cold plate to generate convective heat exchange, then flows into an output manifold flow channel of the lower-layer cold plate through an output through hole of the middle-layer cold plate, and finally flows out from a cooling liquid outlet. The arrangement position of the cold plate penetrates through the shell of the electronic assembly and then is directly connected with the heat sink in a welded mode, the cold plate has the advantages of being small in mass, high in heat exchange efficiency, compact in size, good in array plane temperature uniformity and the like, and customized design can be achieved according to the heat source distribution position on the antenna array plane. The design problems of efficient cooling and light weight of cooling equipment of the radio frequency electronic module with high heat flux density, uneven array heat distribution and high power are solved.

Description

technical field [0001] The invention relates to the technical field of thermal management and structural design of electronic equipment fronts, in particular to a penetrating ultra-thin liquid cold plate integrated with a manifold network of low flow resistance. Background technique [0002] The T / R component in the phased array is a collection of highly concentrated electronic components. Under the requirements of miniaturization and densification, the working power of the T / R component continues to increase, and the heat flux generated by the component also increases further. The heat generation of some chips has reached the hundred-watt level. A large number of T / R components are often integrated on the phased array antenna array. These components are the main source of heat for the entire phased array. With the further maturity of microelectronics technology, the transmission power of high-power amplifiers has increased significantly. The heat dissipation pressure on th...

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Problems solved by technology

[0009] In order to overcome the shortcomings of the above-mentioned prior art, the object of the present invention is to provide a penetrating ultra-thin liquid cold plate integrated with a low flow resistance manifold network. The sinker is welded and connected, which has the characteristics of small cold plate mass, high heat exchange efficiency, compact volume, and good front temperature uniformity. It can be customized according to the distribution position of the heat source on the antenna array. It is especially suitable for solving high heat flux density and front heat. Efficient cooling of unevenly distributed, high-power RF electronic modules and design problems of lightweight cooling equipment

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