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Exhaust-gas plasma detoxification method, and device for same

A plasma and waste gas technology, applied in the directions of plasma, separation method, gas treatment, etc., can solve the problems of not easy to decompose, difficult to remove PFC, and unable to place the greenhouse effect on the earth's environment, so as to achieve the improvement of the removal efficiency. Effect

Active Publication Date: 2021-05-25
BEIJING KANKEN ENVIRONMENTAL PROTECTION EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the lifetime until consumed in the atmosphere, the CF 4 In the case of 50000, in C 2 f 6 In the case of 10,000 years, in addition, for the global warming potential (in CO 2 is a comparison value of 1), CF 4 for 4400, C 2 f 6 6200 (after 20 years), there is a problem of the so-called greenhouse effect that cannot be placed on the earth's environment, and it is expected to establish a 4 、C 2 f 6 PFC as the representative perfluorocarbon method for detoxification
[0004] However, since the C-F bond of perfluorocarbons in PFC is stable (the bonding energy is as high as 130kcal / mol), it is not easy to decompose, and it is very difficult to completely eliminate PFC by general thermal decomposition such as combustion
For example, in pure thermal decomposition, at C 2 f 6 In the case of C-C bonded branches, the decomposition is carried out. Therefore, if the treatment air volume is limited to 250 liters / minute or less at the treatment temperature of 1000 ° C, the detoxification can be carried out, but CF 4 C-F with the largest bonding energy must be cut off, and a high temperature of about 1400-1500°C is required even under the above-mentioned air volume

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  • Exhaust-gas plasma detoxification method, and device for same
  • Exhaust-gas plasma detoxification method, and device for same
  • Exhaust-gas plasma detoxification method, and device for same

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Embodiment Construction

[0037] Hereinafter, the present invention will be described based on illustrated embodiments. figure 1 It is the exhaust gas treatment device X of the present invention. These are devices used in the semiconductor manufacturing process. For example, exhaust gas H exhausted from CVD film formation equipment S is sucked by vacuum pump V, transported to exhaust gas treatment equipment X, decomposed by thermal decomposition, and discharged to the atmosphere.

[0038] In addition, in the description of the background art, the detoxification of PFC exhaust gas was taken as a representative example for description, but since the refractory exhaust gas is not limited to PFC exhaust gas, the gas to be treated in the present invention is simply referred to as exhaust gas H.

[0039] figure 1In one example, the exhaust gas treatment device X is composed of an independent water treatment device A and a thermal decomposition device B provided with an outlet scrubber 60 . Although not sho...

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Abstract

Provided is a plasma detoxification method in which all of exhaust gas charged into a thermolysis column is necessarily passed through a high-temperature region formed by a plasma jet and reliably decomposed. In a method for concentrating a plurality of plasma jets (P) toward a point (Q), the respective plasma jets (P) are generated from a plurality of plasma jet torches (2a, 2b, (2c)) installed facing toward a reaction space (D) of exhaust gas (H), the plasma jets (P) jetting toward the given point (Q) within the reaction space (D), and the exhaust gas (H) is supplied toward the point (Q) from between the plurality of plasma jet torches (2a, 2b, (2c)).

Description

technical field [0001] The present invention relates to the improvement of plasma detoxification method and plasma detoxification device in the thermal decomposition process of waste gas discharged from semiconductor manufacturing process. Background technique [0002] Gases of various compounds are used in the manufacturing process of electronic devices such as semiconductors and liquid crystals, such as CF 4 and C 2 f 6 Such perfluorocarbons, NF 3 Such perfluorinated compounds (hereinafter, referred to as "PFC") such as fluorine compounds not containing carbon are used as cleaning gases for the CVD chamber. In addition, in this specification, the waste gas containing a perfluorinated compound is called a perfluorinated compound waste gas or a PFC waste gas. [0003] Among them, with CF 4 or C 2 f 6 Typical perfluorocarbons are nonflammable and the compounds themselves are stable, so they remain unchanged for a long period of time when they are released into the atmo...

Claims

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Application Information

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IPC IPC(8): B01D53/74B01J19/08H01L21/205H05H1/26B01D53/70
CPCB01D53/70H05H1/26B01D53/74B01J19/08Y02C20/30B01D53/32B01J19/088B01D2259/818H01L21/67017B01D2258/0216
Inventor 池奥哲也
Owner BEIJING KANKEN ENVIRONMENTAL PROTECTION EQUIP CO LTD
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