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Thermosetting resin composition

A resin composition and thermosetting technology, which is applied in the field of thermosetting resin compositions, can solve problems such as the reduction of mechanical strength, and achieve the effect of suppressing the reduction of mechanical strength and good mechanical strength

Pending Publication Date: 2021-05-28
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the thermosetting resin and the inorganic aggregate are gradually peeled off in water or other chemical solutions, and the mechanical strength is lowered.

Method used

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  • Thermosetting resin composition
  • Thermosetting resin composition
  • Thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0196] Add 0.9 g (0.0002 mol) of metal coordination compound (D) to mixture AB-1 (comprising 48 g of unsaturated polyester resin A1 and styrene 32 g) 80 g and ethylenically unsaturated compound (B) 20 g, at 25 ° C Stirring and mixing were performed. 0.5 g (0.002 mol) of thiol compound (C), 100 g of aluminum hydroxide as inorganic aggregate (E), 1.0 g of water (F), and 0.1 g of curing accelerator were added thereto, stirred and mixed, and radical polymerization was further added. 1.0 g of the initiator (G) was stirred and mixed to obtain a thermosetting resin composition.

Embodiment 2～4

[0197] (Examples 2-4, Comparative Examples 1-4)

[0198] With the compounding composition shown in the following Table 1, it carried out similarly to Example 1, and each thermosetting resin composition was obtained. It should be noted that in Comparative Example 4, the surfactant and water (F) were added simultaneously.

[0199] [Evaluation of Thermosetting Resin Composition]

[0200] With respect to the thermosetting resin composition produced in the said Example and the comparative example, the following items were evaluated.

[0201] These evaluation results are collectively shown in Table 1 below.

[0202]

[0203] Cured products of thermosetting resin compositions were obtained by curing the thermosetting resin compositions produced in the above Examples and Comparative Examples at 23° C. for 3 days. The obtained cured product was cut into a rectangular parallelepiped of 10 mm x 80 mm x 4 mm to prepare a test piece.

[0204] (Measurement method of initial flexural m...

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PUM

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Abstract

A thermosetting resin composition contains (A) a thermosetting resin having a plurality of ethylenically unsaturated bonds, (B) an ethylenically unsaturated compound, (C) a thiol compound, (D) a metal complex, (E) an inorganic aggregate, and (F) water. The content of the surfactant is 0 parts by mass or more and less than 0.05 parts by mass with respect to 100 parts by mass of the total content of the thermosetting resin (A), the ethylenically unsaturated compound (B), and the water (F), and the content of the water (F) is 0.5 parts by mass or more and less than 5 parts by mass with respect to 100 parts by mass of the total content of the thermosetting resin (A) and the ethylenically unsaturated compound (B).

Description

technical field [0001] The present invention relates to thermosetting resin compositions. Background technique [0002] Thermosetting resins are used in molding materials, adhesives, primers, coatings, and repair materials for inorganic structures, filling materials, gap filling materials, and fiber-reinforced composite materials for concrete section repair, crack injection, and water sealing. used in a wide range of applications. [0003] Among thermosetting resins, free radically polymerizable thermosetting resins such as unsaturated polyester resins, vinyl ester resins, and urethane acrylate resins often have the advantages of moldability, curability, and adhesion to substrates. It is widely used in the above fields. [0004] In addition, in order to improve the mechanical strength of the cured product of the thermosetting resin, it may be mixed with an inorganic aggregate and used as a thermosetting resin composition. Such a thermosetting resin composition is called r...

Claims

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Application Information

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IPC IPC(8): C08F283/01C08F212/08C08F2/44C08K3/22C08K3/36
CPCC08F283/01C08K3/22C08K3/36C08K2003/2227C08F212/08C08F2/44
Inventor 宇佐美彬西岛大辅山内慎太郎
Owner SHOWA DENKO KK