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Ultra-soft conductive adhesive for 5G spectrum, and preparation method thereof

A technology of conductive adhesive and frequency spectrum, which is applied in the field of conductive adhesive, can solve the problems of high pressure on the box cover, low isolation, and inability to lock the thread, and achieve the effect of tight contact and reduced compression force

Active Publication Date: 2021-05-28
SHENZHEN ACHIEVE TECH & ENGI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The hardness of traditional FIP products is as high as 70ShoreA. In addition, the size of the 5G base station becomes larger, and the pressure required for the box cover is very large, which leads to the inability to lock the thread and the deformation of the cavity. Its weakness in the high frequency band is low. Being infinitely amplified, it cannot meet the isolation requirements of 5G communication signals

Method used

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  • Ultra-soft conductive adhesive for 5G spectrum, and preparation method thereof
  • Ultra-soft conductive adhesive for 5G spectrum, and preparation method thereof
  • Ultra-soft conductive adhesive for 5G spectrum, and preparation method thereof

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preparation example Construction

[0031] The preparation method of the supersoft conductive adhesive for 5G spectrum of the present invention comprises the following steps:

[0032] S1. Weigh the required components according to the ratio;

[0033] S2. Put each component into a stirring container, stir for 1 min at normal temperature and pressure, and rotate at a speed of 25 Hz;

[0034] S3. Adjust the stirring speed to 49Hz, and continue to stir for 6 minutes;

[0035] S4. After scraping the thickness of the wall, vacuumize, the vacuum degree is -0.06 to -0.08MPa, stir for 3min, and the speed is 49Hz.

Embodiment 1

[0037] The ultra-soft conductive adhesive for 5G spectrum in this embodiment includes 0.5% graphene content, 0.5% conductive carbon black content, 55% Ni&C conductive particles, and 6% crosslinking agent II content. Chloromethyltriethoxysilane (ND43), 0.08% of pt curing agent - Shin-Etsu Platinum Water CAT-PL-56, 3% of silica A200, 2% of N-methylpyrrolidone , the content is 0.1% of 1-ethynyl cyclohexanol, and the balance of methyl vinyl silicone rubber, the total amount is 100%.

Embodiment 2

[0039] The ultra-soft conductive adhesive for 5G spectrum in this embodiment includes graphene with a content of 0.1%, conductive carbon black with a content of 0.1%, conductive particles of Ni&C with a content of 49.8%, and crosslinking agent II with a content of 8%. Chloromethyltriethoxysilane (ND43), 0.05% pt curing agent - Shin-Etsu Platinum Water CAT-PL-56, 1% silica A200, 1% N-methylpyrrolidone , the content is 0.15% of 1-ethynyl cyclohexanol, and the balance of methyl vinyl silicone rubber, the total amount is 100%.

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Abstract

The invention provides an ultra-soft conductive adhesive for a 5G frequency spectrum, and a preparation method thereof. The ultra-soft conductive adhesive comprises a silicone rubber carrier, conductive particles, a cross-linking agent, a curing agent, a reinforcing agent, a thixotropic agent and a curing retarder, wherein the content of the conductive particles is 50-60%; the content of the cross-linking agent is 5-8%; the content of the curing agent is 0.05-0.1%; the content of a reinforcing agent is 1-5%; the content of the thixotropic agent is 1-3%; the content of the curing retarder is 0.1 to 0.2 percent; and the content of the silicone rubber carrier is the balance. The conductive elastomer formed by dispensing and curing has ultra-low hardness, not only can the compression force of the upper surface and the lower surface of the base station be greatly reduced, but also the independent cavity walls are more tightly contacted through the elastomer when the upper surface and the lower surface are attached, high isolation is formed for each independent cavity, the isolation can reach 110 dB or above in the frequency band of 300 MHz - 10 GHZ, and, compatibility to electromagnetic waves is achieved, and interference of the electromagnetic waves among the cavities is eliminated.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to an ultra-soft conductive adhesive for 5G spectrum and a preparation method thereof. Background technique [0002] With the gradual maturity, promotion and application of 5G technology, the transmission frequency of 5G signals is higher, the bandwidth is wider, and the data transmission rate is better. The peak rate is greater than 20Gbit per second, which is equivalent to 20 times that of 4G. High, a large number of data models are concentrated in the independent cavity of the base station, because the cavity wall becomes narrow under the dual requirements of saving space and reducing weight, the space for operation is only about 1.8mm, and the formation of each independent cavity requires There are electrically conductive elastomers with as little compressive force as possible for the frequency, so that the individual cavities are individually isolated. The form-in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J183/07C09J11/06
CPCC08K2003/0862C08K2201/001C08K2201/011C09J9/02C09J11/06C09J183/04C08K13/04C08K7/26C08K3/042C08K3/04C08K3/08C08K5/5419C08K5/20
Inventor 邓时秋
Owner SHENZHEN ACHIEVE TECH & ENGI