High-frequency microwave circuit board blind slot structure and implementation method thereof, and device
A high-frequency microwave and implementation method technology, applied in circuit devices, printed circuits, high-frequency matchers, etc., can solve the problems of low reliability of metallized sidewalls, high transmission loss, long process flow, etc., and improve adhesion. and reliability, simple process and high efficiency
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Embodiment 1
[0050] Such as figure 2 As shown, Embodiment 1 provides an improved sidewall metallization and bottom groove structure with patterned lines, and its structural features are as follows:
[0051] 1) The bottom of the blind groove structure 5 has a patterned circuit 11, and the side wall has a metallized coating 52;
[0052] 2) The bottom of the side wall metallization coating 52 includes a metallization pin 521 extending into the groove;
[0053] 3) There is a height difference h between the end of the metallization pin 521 and the patterned line 11 at the bottom of the blind groove structure 5, and the end of the metallization pin 521 and the patterned line 11 at the bottom of the blind groove form a void. Cavity structure V.
[0054] The cavity groove structure refers to a groove with a patterned circuit 11 at the bottom and no metallized coating on the side wall.
[0055] The value of the height difference h can be adjusted according to design and process capability, and ...
Embodiment 2
[0059] In this embodiment, a method for manufacturing a high-frequency microwave printed circuit with the above-mentioned blind slot structure is provided. Its manufacturing process flow chart is as follows Figure 4 shown.
[0060] Specifically, the implementation process of the manufacturing method includes the following steps:
[0061] (S100) Provide the lower sub-board 1, the inner core board 3, the first lamination adhesive sheet 21, the second lamination adhesive sheet 22, and the outer core board 4. The laminated adhesive sheet 21, the inner layer core board 3, the second laminated adhesive sheet 22, and the lower sub-board 1 are laminated in sequence, and laminated and bonded as a whole. The sequence of laminated layers is as follows: Figure 5 As shown, the overall structure of the laminated printed board is as follows Figure 6 shown.
[0062] The lower sub-board 1 is a double-layer wiring board or a multi-layer wiring substrate, and a patterned circuit 11 is arr...
Embodiment 3
[0080] After preliminarily completing the processing of the blind slot structure 5 , surface coating can also be performed on the patterned circuit at the bottom of the blind slot and other lines according to actual production and application requirements. The surface coating includes, but is not limited to, electroplated gold, chemical nickel-gold, electroplated nickel-gold, chemical nickel-palladium-gold, and the like.
[0081] Optionally, the printed plate shape can be further milled according to the preset size to form an edge blind groove structure. The embodiment of the present invention does not limit the specific manner of subsequent processing.
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