Wafer edge polishing device and method

Abstract

The invention belongs to the field of wafer polishing equipment, and particularly relates to a wafer edge polishing device and method. The wafer edge polishing device comprises a wafer fixing and overturning assembly, the wafer fixing and overturning assembly comprises a pushing linear module and a machine base, a driven supporting base is arranged on the side of the machine base, a supporting arm capable of swinging is arranged on the driven supporting base, and the supporting arm and a swing arm are arranged on the two sides of a wafer rotating assembly respectively and used for supporting the wafer rotating assembly; a wafer is arranged on the wafer rotating assembly; a ramming head driving assembly comprises a base, a linear bearing mounting plate is mounted on the base, a plurality of linear bearings are arranged on the linear bearing mounting plate, a guide shaft is arranged in each linear bearing, the upper end of each guide shaft is fixed to an upper connecting plate, and the lower end of each guide shaft is fixed to a lower mounting plate; and ramming head assemblies is arranged below the lower mounting plate through shafts. According to the wafer edge polishing device and method, a polishing solution is prevented from splashing everywhere, the loss amount of the polishing solution is greatly reduced, most importantly, the polishing solution is not left on the surface of the wafer, and the problem that the surface of the wafer has adsorption traces is solved.

Description

technical field [0001] The invention belongs to the field of wafer polishing equipment, and in particular relates to a wafer edge polishing device and a polishing method. Background technique [0002] Semiconductor silicon wafers are the main substrate material for manufacturing VLSI. With the rapid development of the semiconductor industry, the precision requirements for substrate materials are getting higher and higher, especially for the edge surface state of silicon polished wafers. more stringent. For silicon polishing wafers with a diameter of more than 6 inches, especially 8 inches and 12 inches, it is generally necessary to polish the edge surface of the wafer during substrate processing, so as to ensure that no slip lines are generated at the edge of the wafer during epitaxy Or defects such as epitaxial stacking faults, thereby improving the yield of epitaxial wafers or devices. The edge polishing of the wafer is generally completed on an independent equipment, us...

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Problems solved by technology

But no matter which way, it is necessary to spray the polishing liquid on the polishing part of the wafer, and the polishing liquid splashes everywhere, so that the lower surface of the wafer and the vacuum chuck will produce suction cup marks, which will affect the surface quality of the wafer.

[0004] In addition, the existing wafer edge polishing method is to polish the wafer edge surface through the relative friction generated by the forward rotation of the wafer and the reverse rotation of the polishing head assembly, which results in higher requirements for the rotation of the wafer and the polishing head. Concentricity, otherwise it is easy to cause fragmentation

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