Screen binder and using method thereof
A binder and screen technology, applied in the direction of adhesives, adhesive types, non-polymer adhesive additives, etc., can solve the problems of poor adaptability, good barrier performance, and strong adhesion of flexible screens, and achieve bonding Good effect, good weather resistance, simple and convenient operation
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Embodiment 1
[0050] A kind of organosilicon modified epoxy resin, comprises preparation steps:
[0051] At 25°C, 100 grams of bisphenol A epoxy resin E-55 and 30 grams of amino silicone oil with a molecular weight of 2000 and 10 grams of KH560 (γ-(2,3-epoxypropoxy)propyltrimethyl Add oxysilane into the three-necked flask, mix it evenly under vigorous stirring, then add 1 gram of dibutyltin dilaurate, raise the temperature to 110°C and keep stirring for 2 hours, cool down naturally to obtain silicone modified permanent epoxy resin products.
Embodiment 2
[0053] A kind of bonding agent for screen, comprises preparation steps:
[0054] ①Add the following materials sequentially into the dispersing mixer: 100g of E51 epoxy resin, 25g of the silicone-modified epoxy resin prepared in Example 1, and mechanically stir and disperse at a speed of 300 rpm for 60 minutes. Add the prepared 5g nanoparticle composition in 3 batches (the same quality of each batch) during the stirring process, which contains 4g of nanometer SiO in the composition 2 (Particle size 150nm), 1g nano TiO 2 (particle size 150nm), continue to stir, and disperse with mechanical stirring at a speed of 400 rpm for 90 minutes to obtain the final A component.
[0055] ② Add the following materials in sequence in the dispersing mixer: 100g of polyetheramine D400, 40g of polyetheramine D2000, 7g of curing accelerator DMP-30, and mechanically stir and disperse at a speed of 300 rpm for 90 minutes. The prepared The finished product is B component.
[0056] ③The curing rat...
Embodiment 3
[0058] A kind of bonding agent for screen, comprises preparation steps:
[0059] ①Add the following materials sequentially into the dispersing mixer: 100g of E51 epoxy resin, 40g of the silicone-modified epoxy resin prepared in Example 1, and mechanically stir and disperse at a speed of 300 rpm for 60 minutes. Add the prepared 10g nanoparticle composition in 3 batches (the same quality of each batch) in the stirring process, which contains 8g of nanometer SiO in the composition 2(Particle size 50nm), 2g nano TiO 2 (particle size 50nm), continue to stir, and disperse with mechanical stirring at a speed of 400 rpm for 90 minutes to obtain the final A component.
[0060] ② Add the following materials in sequence in the dispersing mixer: 100g of polyetheramine D400, 50g of polyetheramine D2000, 15g of curing accelerator DMP-30, and mechanically stir and disperse at a speed of 300 rpm for 90 minutes. The prepared The finished product is B component.
[0061] ③The curing ratio of...
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