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Method for cleaning liner of semiconductor etching machine

A semiconductor and machine technology, used in cleaning methods and utensils, chemical instruments and methods, and dust removal, etc., can solve problems such as cleaning the inner surface of complex structures, and achieve the effect of improving efficiency and surface quality and avoiding loss.

Inactive Publication Date: 2021-06-04
芜湖芯通半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for cleaning the inner lining of a semiconductor etching machine, the purpose of which is to solve the problem of cleaning the inner surface with a complex structure

Method used

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  • Method for cleaning liner of semiconductor etching machine
  • Method for cleaning liner of semiconductor etching machine
  • Method for cleaning liner of semiconductor etching machine

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Embodiment Construction

[0021] The specific implementation of the present invention will be described in further detail below by describing the embodiments with reference to the accompanying drawings, so as to help those skilled in the art have a more complete, accurate and in-depth understanding of the inventive concepts and technical solutions of the present invention.

[0022] The invention relates to a method for cleaning the inner liner of a semiconductor etching machine using micropowder blasting. Sandblasting stripping is used in surface treatment and component cleaning to completely remove a small amount of residue or natural adsorption layer on the surface of the component. Sandblasting stripping is under a certain air pressure, through the compressed air flow, the gravel is driven to impact on the surface of the object to be treated, and the impact force of the gravel will sputter and peel off the attached substances on the surface of the object to be treated, which will cause certain physic...

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Abstract

The invention discloses a method for cleaning a liner of a semiconductor etching machine. The method for cleaning the liner of the semiconductor etching machine comprises the following steps of: adopting micro powder as a sand blasting material, performing sand blasting under a certain gas pressure, cleaning the liner of the semiconductor etching machine, and removing an etching reaction product on the surface of the liner. By adopting the technical scheme, the micro powder with extremely small particles is selected as the sand blasting sand material, and the reasonable carrier gas flow pressure is tested and adjusted, so that the micro powder particles can be effectively sprayed out at a constant speed, etching products adsorbed on the surface of the liner can be uniformly and thoroughly removed, obvious damage to the surface of the liner caused by overlarge pressure can be avoided, surface treatment of a product with a complex internal structure is achieved, and the surface treatment efficiency and the surface quality are improved.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of semiconductor product process equipment, and more specifically, the invention relates to a method for cleaning the lining of a semiconductor etching machine. Background technique [0002] Etching is one of the key steps in the production process of semiconductor integrated circuits. At present, most of the reaction chambers of etching machines use inner lining parts, which function to form a certain anodic film (generally 50-70 μm hard anode) on the surface of the aluminum alloy substrate to resist the etching process. Corrosion of components by the environment. like figure 1 As shown, some machines with higher requirements will continue to spray a special ceramic-like coating layer (coating, generally 100-150μm thick) on the surface of the anode layer to further improve corrosion resistance. [0003] With the operation of the etching process, a certain amount of etching reaction p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00B08B9/08B08B9/093B08B9/38B08B15/04
CPCB08B7/00B08B9/08B08B9/093B08B9/38B08B15/04
Inventor 吴小杰刘贤
Owner 芜湖芯通半导体材料有限公司
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