Ion beam coating equipment and coating method thereof

Abstract

The invention discloses ion beam coating equipment and a coating method thereof. The ion beam coating equipment comprises a transfer chamber and a substrate loading and unloading chamber, a coating chamber and a cleaning chamber which are connected to the transfer chamber, isolation valves are arranged among the substrate loading and unloading chamber, the coating chamber and the cleaning chamber, and a transfer mechanism is arranged in the transfer chamber. According to the film coating method, the equipment is adopted for coating treatment. In the ion beam coating equipment, the substrate loading and unloading chamber is used for storing different types of substrates, the transfer chamber is used for transferring the substrates among the substrate loading and unloading chamber, the coating chamber and the cleaning chamber, the coating chamber can be used for coating a plurality of substrates at the same time and can also be used for preparing various types of film layers, and the cleaning chamber is used for removing dirt and oxides on the surfaces of the substrates, and the adhesive force between the film and the substrate is improved. According to the ion beam coating equipment, continuous cleaning and continuous coating of the substrate can be achieved, continuous production can be achieved, the production efficiency can be improved, the production cost can be reduced, and the requirements of the substrate (such as an infrared device) for the large-size, low-damage and low-temperature coating process can be met.

Description

technical field [0001] The invention relates to an ion beam coating device and a coating method thereof. Background technique [0002] Ion beam sputtering coating technology is one of the most important technologies among various coating technologies, and is widely used in the fields of optical components, aircraft engines, microelectronic devices and material surface treatment. [0003] Substrate metallization and passivation / insulation layer processes require good adhesion between the film and the substrate, as well as low temperature during substrate deposition and a large uniform area of ​​deposited film. Therefore, it is necessary to remove impurity materials on the surface of the substrate before coating However, in the existing coating equipment, cleaning and coating are completed in two different equipments, and there are following defects: (1) can only realize the coating of a single substrate, and cannot simultaneously coat a plurality of substrates, nor can Reali...

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Problems solved by technology

[0003] Substrate metallization and passivation / insulation layer processes require good adhesion between the film and the substrate, as well as low temperature during substrate deposition and a large uniform area of ​​deposited film. Therefore, it is necessary to remove impurity materials on the surface of the substrate before coating However, in the existing coating equipment, cleaning and coating are completed in two different equipments, and there are following defects: (1) can only realize the coating of a single substrate, and cannot simultaneously coat a plurality of substrates, nor can Realize the simultaneous preparation of different types of films, which cannot be mass-produced; (2) does not have the function of an independent loading and unloading chamber, and the process chamber needs to be opened every time cleaning and coating are completed, which takes a long time to establish a vacuum, short effective working time, and low coating efficiency ;(3) Most of the existing ion beam coating equipment are small-sized substrates and manual scientific research equipment, which do not have the automatic adjustment function of cleaning angle and coating angle, and do not have the online monitoring function of the coating film layer; (4) Without a temperature control device and a cooling device, it is impossible to ensure that the infrared device is cleaned and coated at a lower temperature, which may easily cause the loss of the infrared device. This is because the substrate material of the infrared device is HgCdTe, which is heated by plasma bombardment. After reaching a certain temperature, mercury atoms are easy to escape, which will cause chip damage

In addition, the existing ion beam coating equipment usually uses a multi-faceted target platform for multi-layer thin film preparation, and there is cross-contamination phenomenon. At the same time, the workpiece platform does not have the angle adjustment function, and it is difficult to meet the requirements of different crystal orientation materials on the substrate deposition angle.

The existence of the above-mentioned defects makes it difficult for existing ion beam coating equipment to meet the requirements of large-size, high-uniformity, low-damage, and low-temperature coating processes for substrates (such as infrared devices)

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