Large-scale high-speed rotation equipment assembly stress measurement method based on critical refraction longitudinal waves
A technology of critical refraction and assembly stress, which is applied to force/torque/work measuring instruments, measuring devices, and the use of sound waves/ultrasonic waves/infrasonic waves to analyze solids, etc., which can solve the problem that the spatial resolution of signal separation cannot be guaranteed at the same time, rotor surface corrosion, measurement Low efficiency and other problems, achieve the effect of multi-point scanning measurement, eliminate corrosion and pollution, and improve measurement efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0032] DETAILED DESCRIPTION One: Combination figure 1 and figure 2 According to the present embodiment, a large high-speed rotary equipped fitting stress measurement method based on a critical refractive longitudinal wave is implemented using a measuring device including a side-arranged emitter 1, a first receiving wheel 2, a second receiving wheel 3, and an installation. The transmitting transducer 4 in the emitter 1 is mounted in the first receiving transducer 5 in the first receiving wheel 2 and a second receiving transducer 6 mounted in the second receiving wheel 3, the emitter 1, The axis of the first receiving wheel 2 and the second receiving wheel 3 are disposed in parallel with each other;
[0033] The measurement method includes the steps of:
[0034] Step 1, according to the material characteristics of the rotor member 100, adjust the inclination angle of the emission transducer 4, the first receiving transducer 5, and the second receiving transducer 6, and the emission ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap