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Quick-bonding UV/moisture dual-curing adhesive and preparation method thereof

A dual-curing, adhesive technology, used in adhesives, adhesive types, adhesive additives, etc., can solve the problem that two-component structural adhesives and PUR hot-melt adhesives cannot achieve instant bonding and positioning, double-sided adhesive Insufficient relay, etc.

Pending Publication Date: 2021-06-08
HANGZHOU BAOMING NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the problem of insufficient adhesion of conventional double-sided adhesives in the prior art, two-component structural adhesives and PUR hot-melt adhesives cannot achieve instant bonding and positioning, and require fixtures to maintain pressure

Method used

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  • Quick-bonding UV/moisture dual-curing adhesive and preparation method thereof
  • Quick-bonding UV/moisture dual-curing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1: Synthesis of UV / Moisture Dual Curing Urethane Acrylic Resin

[0025] 50.0 parts of PPG-2000 (polyether diol, Dow, USA) were dehydrated under vacuum at 110°C for 2 hours, and the temperature was lowered to 70°C. Added 30 parts of polymeric MDI (8319, Yantai Wanhua), 0.01 parts of Butyl tin, reacted for 2 hours. Add 2.0 parts of hydroxyethylacrylamide and continue the reaction for 2 hours. After vacuum defoaming for 0.5 hour, a UV / moisture dual-curing polyurethane acrylic resin (named as resin 1) was obtained.

Embodiment 2

[0026] Example 2: Synthesis of UV / Moisture Dual Curing Urethane Acrylic Resin

[0027] 56.0 parts of PCL220 (polycaprolactone diol, Daicel Corporation, Japan) were vacuum dehydrated at 110°C for 2 hours, the temperature was lowered to 70°C, 40 parts of polymeric MDI (8319, Yantai Wanhua), 0.01 parts of dilauric acid di Butyl tin, reacted for 2 hours. 4.0 parts of hydroxyethylacrylamide was added, and the reaction was continued for 2 hours. After vacuum defoaming for 0.5 hour, a UV / moisture dual-curing polyurethane acrylic resin (named as resin 2) was obtained.

Embodiment 3

[0031] Mix the following compounds uniformly under vacuum conditions: 30.0 g of monofunctional urethane acrylic resin (GENOMER*4188, RAHN company), 15.0 g of UV / moisture dual curing urethane acrylic resin (self-made resin 1), 4.5 g of isooctyl acrylate , fumed silica (TS720, Cabot Corporation) 1.0 g, photoinitiator (ethyl 2,4,6-trimethylbenzoylphenylphosphonate) 1.5 g, dibutyltin dilaurate 0.01 g. Apply the mixed raw materials on the glass sample strip, use LED lamp (365nm, curing energy is 2000mJ / cm 2 ) after irradiation, attach the glass sample strips to test the initial adhesive force and the adhesive force after moisture curing.

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PUM

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Abstract

The invention discloses a quick-bonding UV / moisture dual-curing adhesive and a preparation method thereof. The adhesive is prepared from the following components in parts by mass: 10.0 to 50.0 parts of polyurethane acrylic resin, 10.0 to 50.0 parts of ultraviolet / moisture dual-curing polyurethane acrylic resin, 5 to 30.0 parts of reactive diluent, 0.1 to 8.0 parts of a photoinitiator, 0.01 to 2.0 parts of a moisture curing catalyst, 0 to 15 parts of tackifying resin and 0.5 to 10 parts of a thixotropic agent. According to the UV / moisture dual-curing adhesive provided by the invention, a pressure-sensitive adhesive can be formed on site after ultraviolet light is cured, initial adhesion can be formed immediately, and clamp pressure maintaining is not needed, so that the problem that clamp pressure maintaining is needed in electronic product assembly is solved,electronic product assembling can be accelerated, and the efficiency is improved. In addition, the adhesive prepared from the monofunctional polyurethane acrylic resin has higher autohension.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a quick-bonding UV / moisture dual-curing adhesive and a preparation method thereof. Background technique [0002] At present, the following three types of solutions are mainly used for the bonding of electronic product casings and frames: [0003] 1. Use double-sided adhesive tape for bonding. This solution can produce adhesive force immediately after the shell and the frame are bonded, and there is no need to maintain pressure. However, if double-sided adhesive tape is used for bonding, the corners are easy to warp and fall off, especially It is in the case of narrow borders, and it is not suitable for special-shaped screens. [0004] 2. Use two-component structural adhesives, generally two-component acrylic adhesives. This solution has very high adhesive force, high bonding reliability and can be cured at room temperature. However, since the glue is in the form of two compo...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J11/04C09J11/08
CPCC09J175/14C09J11/04C09J11/08C08L2205/025C08L2205/03C08L75/14C08L67/00C08K3/36
Inventor 李世贤林江滨
Owner HANGZHOU BAOMING NEW MATERIAL TECH CO LTD
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