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A method for preparing diamond-reinforced metal matrix composites with high surface precision and high reliability

A diamond reinforced and composite material technology is applied in the field of metal matrix composite materials and its preparation, which can solve the problems of low surface precision and poor reliability, and achieve the effects of high surface precision and thermal conductivity, improved thermal conductivity and simple process method.

Active Publication Date: 2021-11-26
HARBIN INST OF TECH
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  • Application Information

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Problems solved by technology

[0004] In order to solve the problems of low surface precision and poor reliability of existing diamond-reinforced metal matrix composite materials, the present invention proposes a method for preparing diamond-reinforced metal matrix composite materials with high surface precision and high reliability

Method used

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  • A method for preparing diamond-reinforced metal matrix composites with high surface precision and high reliability

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specific Embodiment approach 1

[0021] Specific implementation mode 1: The preparation method of diamond-reinforced metal matrix composite material with high surface precision and high reliability in this implementation mode is carried out according to the following steps:

[0022] 1. Weighing: Weigh 5% to 8% of diamond powder with an average particle size of 5 to 20 μm, 45% to 72% of diamond powder with an average particle size of 20 to 300 μm, and the rest of the metal matrix by volume fraction;

[0023] The diamond powder with an average particle size of 5-20 μm and the diamond powder with an average particle size of 20-300 μm have a coating on the surface; the coating material is W, Mo, Cr, Ti, etc.;

[0024] W, Mo, Cr, and Ti are easy to react with diamond at high temperature to form carbides, and the formed carbides are stable, and will not cause significant changes in thermal conductivity after wet heat treatment.

[0025] 2. Preparation of diamond preform:

[0026] Take 50% of the diamond powder wit...

specific Embodiment approach 2

[0034] Embodiment 2: This embodiment differs from Embodiment 1 in that: the metal substrate in Step 1 is pure aluminum, aluminum alloy, pure copper or copper alloy.

specific Embodiment approach 3

[0035] Specific embodiment three: the difference between this embodiment and specific embodiment two is that the aluminum alloy is Al-Si alloy, Al-Si-Cu alloy, Al-Cu-Mg alloy, Al-Zn-Cu alloy, Al- One or a combination of Zn-Mg-Cu alloys, Al-Si-Cu-Mg alloys; the copper alloy is one or several of Cu-Zn, Cu-Sn, Cu-Ni alloys combination of species.

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Abstract

A method for preparing a diamond-reinforced metal-matrix composite material with high surface precision and high reliability relates to the preparation of the metal-matrix composite material. The purpose is to solve the problems of low surface precision and poor reliability of diamond-reinforced metal matrix composites. Method: Spread diamond powder with a particle size of 5-20 μm on the bottom of the mold, then spread diamond powder with a particle size of 20-300 μm, and finally spread the remaining diamond powder with a particle size of 5-20 μm, vibrate and cold press to obtain The diamond body is subjected to spark plasma sintering and pressure infiltration. The composite material prepared by the invention has high surface precision, thermal conductivity and reliability. The coating on the surface of the diamond is sintered together by spark plasma sintering to form a continuous three-dimensional interconnected network-like thermal conduction path, which improves the thermal conductivity of the prepared composite material. This method is suitable for the preparation of diamond-reinforced metal matrix composites.

Description

technical field [0001] The invention relates to a metal matrix composite material and a preparation method thereof. Background technique [0002] With the rapid development of electronic packaging technology, especially electronic products such as mobile phones, computers, and televisions are increasingly pursuing thinner and lighter sizes, which means that the integration of integrated circuits is getting higher and higher, and the size of electronic components is getting smaller and smaller. , leading to the increasing calorific value of integrated circuits per unit area and unit time, and the burden of heat dissipation on electronic packaging materials is becoming heavier and heavier. Therefore, high thermal conductivity has become an essential requirement for electronic packaging materials. Therefore, it is imminent to develop new electronic packaging materials with high thermal conductivity, low density, and sufficient strength and stiffness. Diamond has very excellent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/10B22F1/02C22C26/00C01B32/28
CPCC22C1/1036C22C1/1015C22C26/00C01B32/28B22F1/17C22C1/1073
Inventor 张强孙凯杨文澍修子扬周畅陈国钦武高辉芶华松姜龙涛康鹏超乔菁
Owner HARBIN INST OF TECH
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