Adapter plate and preparation method thereof

Abstract

The present invention provides an adapter board and a preparation method thereof. Firstly, a composite wiring structure having a first substrate, a first rewiring structure and a second rewiring structure is prepared, and then the composite wiring structure with a certain metal wiring layer is placed in the In the groove of the second substrate with TSV pillars, the composite wiring structure is electrically connected to the rewiring structure on the surface of the second substrate, thereby finally forming an interposer board with densely wired areas and sparsely wired areas, which can solve the problem of Quality problems such as warping and delamination caused by the high stress caused by multi-layer wiring can also reduce the production time of the adapter board, reduce the difficulty of the process, and facilitate subsequent circuit connections.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an adapter board and a preparation method thereof. Background technique [0002] Millimeter wave radio frequency technology is developing rapidly in the semiconductor industry, and it has been widely used in high-speed data communications, automotive radar, airborne missile tracking systems, and spatial spectral detection and imaging. New applications have put forward new requirements for the electrical performance, compact structure and system reliability of the product. For wireless transmitting and receiving systems, they cannot be integrated into the same chip (SOC), so it is necessary to integrate different chips such as radio frequency units, filters, power amplifiers, etc. into an independent system to achieve The function of transmitting and receiving signals. [0003] For most radio frequency chips, because the transmission of radio frequency signals needs to cr...

AI Technical Summary

Problems solved by technology

However, this setting is a great challenge for the wiring of the subsequent packaging substrate, especially for the silicon-based packaging interposer. For example, in the process of 3D packaging, most companies are trying to minimize the surface of the silicon-based interposer Number of wiring layers to reduce warping of the silicon-based interposer due to too many wiring layers in the silicon

Although the number of wiring layers can be reduced by increasing the wiring density, in the special wiring settings of RF wiring, considering the problems of crosstalk and insertion loss between inter-layer signals, it is often impossible for the module to increase the wiring density of certain layers. reduce the number of layers

Therefore, the multi-layer wiring with a large thickness in the RF chip is a big challenge for the production process of the large-sized and thin interposer board and the subsequent micro-assembly process. At the same time, too many wiring layers are easy Delamination of wiring layers due to high stress occurs

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