Normal-temperature curing type metal primer and preparation method thereof
A room temperature curing, metal bottom technology, applied in coatings, epoxy resin coatings, polyurea/polyurethane coatings, etc., can solve the problems of difficult pre-treatment production lines, time-consuming and energy-consuming
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Embodiment 1
[0025] This embodiment provides a solvent-based metal primer, which is prepared through the following steps:
[0026] (a) 100 parts by weight of high molecular weight epoxy resin (usually bisphenol A type, with a softening point of 140°C-155°C) and 20 parts by weight of heat-activated TPU resin (heat activation temperature of 50°C-60°C) are dissolved In 680 parts by weight of a mixed solvent (butanone: ethyl acetate: butyl acetate = 2:1:1, volume ratio), stir and dissolve to obtain component A, with a solid content of 15%, marked as: A1 (Example);
[0027] (b) Dissolve 100 parts by weight of polyisocyanate (polyphenyl polyisocyanate) in 100 parts by weight of ethyl acetate to obtain the first mixture; dissolve 10 parts by weight of silane coupling agent (aminosilane) in 40 parts by weight of ethyl acetate The second mixture was obtained in the ester; under the high-speed stirring state, the second mixture was added dropwise to the first mixture, and the B component was obtaine...
Embodiment 2
[0029] This embodiment provides a solvent-based metal primer, which is prepared through the following steps:
[0030] Basically consistent with that in Example 1, the difference is: in A2 (embodiment), the ratio of macromolecular epoxy resin and TPU is 100:30; Among the B2 (embodiment), the ratio of isocyanate and silane coupling agent is 100 :20.
Embodiment 3
[0032] This embodiment provides a solvent-based metal primer, which is prepared through the following steps:
[0033] Basically consistent with that in Example 1, the difference is: in A3 (embodiment), the ratio of polymer epoxy resin and TPU is 100:40; among the B3 (embodiment), the ratio of isocyanate and silane coupling agent is 100 :30.
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