Package structure with antenna and manufacturing method thereof

Abstract

The invention discloses a packaging structure with an antenna, which includes a packaging body, an antenna circuit, an interconnecting circuit, an outer layer circuit and a chip. The interior of the packaging body is encapsulated with a first conducting through-hole post and a second conducting through-hole post , the antenna circuit is arranged on the first surface and sidewall of the package body, the interconnection circuit is packaged in the package body, and is connected with the antenna circuit through the first conductive via post, the outer layer circuit is arranged on the second surface of the package body, and The second conductive via post is connected with the interconnection line, the outer layer line is also connected with conductive pins, the chip is packaged in the package body, and is connected with the interconnection line or the outer layer line. The invention also discloses a manufacturing method of the packaging structure with the antenna. The invention arranges the antenna lines on the surface and sidewall of the package body, which can make full use of the wiring space of the package body, which is conducive to arranging more antenna lines and prolonging the length of the antenna, so as to improve the signal transmission quality of the antenna line.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure with an antenna and a manufacturing method thereof. Background technique [0002] With the advancement of technology, wireless communication devices usually have the antennas containing the transmitting and receiving radio frequency signals located on different parts of the circuit board and interconnected by the traces of the circuit, however, both parts of the antenna and the circuit board may be The separate manufacturing cost is generated, and the discrete antenna installation method can no longer meet the requirements of high integration and miniaturization of electronic equipment, so the antenna packaging technology has gradually become the focus of the advanced packaging industry. [0003] In the current antenna packaging technology, after the chips (including passive components and bare chips) are plastic-encapsulated, the antenna lay...

AI Technical Summary

Problems solved by technology

In this type of packaging technology, the antenna layer structure will additionally occupy the area on the surface of the plastic package that was originally used for arranging the wiring of the rewiring layer, or occupy the area on the surface of the packaging substrate, so it has a certain impact on the design and manufacturing process of the overall packaging wiring. limits

The length of the antenna is directly related to the transmission and reception of signals. There are many spectrums in 5G communication. In order to meet more antenna configurations, different antenna lengths need to be set. The antenna length determines the thickness of the packaging dielectric layer, making the antenna package unable to achieve miniaturization. requirements

[0004] In addition, due to the requirements of signal quality and transmission speed, more antennas need to be configured. However, in the existing wireless communication modules, the antenna structure is planar, and the length and width of the substrate are fixed, resulting in the wiring space (number of layers) ) is limited, thus limiting the function of the antenna structure, unable to meet the spatial coverage of the signal, and affecting the transmission and reception of the signal, making it difficult for the antenna structure to meet the needs of the communication system operation

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