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Sorting equipment for chip production

A technology of chips and equipment, which is applied in the field of sorting equipment for chip production, can solve problems such as the inability of the suction cup to absorb chips, the aging of the suction cup, and the increase of the gap between the suction cup and the chip, so as to prevent the influence of normal adsorption work and reduce the damage caused by falling probability, and the effect of avoiding the damage of the connecting pipe

Inactive Publication Date: 2021-07-02
赵虎珍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing chip sorting equipment uses the suction cup to absorb chips for a long time, the suction cup is prone to aging, which is easy to cause air leakage, which affects the adsorption work of the suction cup. Not only that, the existing chip sorting equipment is in When absorbing the chip, there will be debris on the chip. If it is not cleaned in time, the gap between the suction cup and the chip will be increased, so that the suction cup cannot absorb the chip, affecting the normal sorting work, thereby reducing the existing chips. Reliability of sorting equipment

Method used

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  • Sorting equipment for chip production
  • Sorting equipment for chip production
  • Sorting equipment for chip production

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Embodiment Construction

[0027] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0028] Such as figure 1 As shown, a kind of sorting equipment for chip production, including a workbench 1, a top plate 3, a suction pump 4, a connecting pipe 7, a suction cup 8, a first branch pipe 5, a second branch pipe 6 and two fixed rods 2, Two fixed rods 2 are vertically fixed on both sides above the workbench 1 respectively, the two sides of the top plate 3 are fixedly connected with the tops of the two fixed rods 2 respectively, and the suction pump 4 is fixed below the top plate 3 , the suction pump 4 communicates with the first branch pipe 5, the suction pump 4 communicates with one end of the second branch pipe 6, one end of the connecting pipe 7 ...

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Abstract

The invention relates to sorting equipment for chip production. The sorting equipment comprises a workbench, a top plate, a suction pump, a connecting pipe, a suction cup, a first branch pipe, a second branch pipe and two fixing rods, and further comprises a dust removal mechanism and a fixing mechanism. The dust removal mechanism comprises a motor, a first gear, a second gear, a first through pipe, a second through pipe, a dust removal assembly, a first bearing, a rotating pipe, two limiting assemblies and two nozzles, and the fixing mechanism comprises a rotating shaft, a first bevel gear, a second bevel gear, two first bearings and two fixing assemblies. According to the sorting equipment for chip production, through the dust removal mechanism, the dust removal function of chips is achieved, the situation that dust attached to the chips increases a gap when the suction cup abuts against the chips is avoided, the phenomenon of air leakage is avoided, and the situation that the adsorption effect is affected is avoided; and through the fixing mechanism, the function that the connecting pipe can be clamped when the chips are adsorbed is achieved, and the situation that when the chips are adsorbed, a gap is formed between the connecting pipe and the second branch pipe is avoided, so that the phenomenon of air leakage is avoided.

Description

technical field [0001] The invention relates to the field of chips, in particular to a sorting device for chip production. Background technique [0002] The chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device, etc. At this time, Although the holding tape glued on the back is cut into several pieces, it is not cut off and becomes the state of holding each semiconductor chip. The chip is removed from the holding tape and placed in the chip carrier for subsequent assembly. This process is called chip sorting. Sorting will install electrical properties to separate the chips into good and bad or into different grades. [0003] When the existing chip sorting equipment uses the suction cup to absorb chips for a long time, the suction cup is prone to aging, which is e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/344B07C5/02B07C5/36B08B1/00B08B1/04B08B5/02B65G47/90
CPCB07C5/344B07C5/02B07C5/362B08B5/02B65G47/90B08B1/12B08B1/32
Inventor 赵虎珍
Owner 赵虎珍
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