High-flux thermal evaporation film preparation device and application thereof

A technology of thin film preparation and thermal evaporation, applied in vacuum evaporation coating, from condensed steam, crystal growth, etc., can solve problems such as complex operation, reduce temperature difference, improve space utilization, and reduce possibility

Pending Publication Date: 2021-07-02
HANGZHOU GALAXY MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, one set of masking mechanism in this equipment can only plate one type of plated sheet, and different types of plated sheets need to be replaced with different masking mechanisms, which is complicated to operate.

Method used

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  • High-flux thermal evaporation film preparation device and application thereof
  • High-flux thermal evaporation film preparation device and application thereof
  • High-flux thermal evaporation film preparation device and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] This embodiment provides a high-throughput thermal evaporation thin film preparation device, and the structural schematic diagram of the high-throughput thermal evaporation thin film preparation device is as follows figure 1 As shown, it includes an evaporation chamber 1 and a storage chamber 2 .

[0082] The evaporation chamber 1 communicates with the storage chamber 2 through a flexible connection pipeline 4 ; the communication pipeline between the evaporation chamber 1 and the storage chamber 2 is provided with a stopper 3 . The evaporation chamber 2 is provided with a thermal evaporation coating device system.

[0083] The evaporation chamber 1 is provided with a thermal evaporation source 1-1, and the thermal evaporation source 1-1 is provided with a concave cavity for placing the crucible 2-1.

[0084] The storage chamber 2 is provided with a crucible storage rack 2-2 and a manipulator 2-3; the manipulator 2-3 is used for transporting the crucible 2-1 between the...

Embodiment 2

[0096] This embodiment provides a high-throughput thermal evaporation thin film preparation device, and the structural schematic diagram of the high-throughput thermal evaporation thin film preparation device is as follows figure 1 As shown, it includes an evaporation chamber 1 and a storage chamber 2 .

[0097] The evaporation chamber 1 communicates with the storage chamber 2 through a flexible connection pipeline 4 ; the communication pipeline between the evaporation chamber 1 and the storage chamber 2 is provided with a stopper 3 . The evaporation chamber 2 is provided with a thermal evaporation coating device system.

[0098] The evaporation chamber 1 is provided with a thermal evaporation source 1-1, and the thermal evaporation source 1-1 is provided with a concave cavity for placing the crucible 2-1.

[0099] The storage chamber 2 is provided with a crucible storage rack 2-2 and a manipulator 2-3; the manipulator 2-3 is used for transporting the crucible 2-1 between the...

Embodiment 3

[0111] This embodiment provides a high-throughput thermal evaporation thin film preparation device, and the structural schematic diagram of the high-throughput thermal evaporation thin film preparation device is as follows figure 1 As shown, including evaporation chamber 1 and storage chamber 2;

[0112] The evaporation chamber 1 communicates with the storage chamber 2 through a flexible connection pipeline 4 ; the communication pipeline between the evaporation chamber 1 and the storage chamber 2 is provided with a stopper 3 .

[0113] The evaporation chamber 1 is provided with a thermal evaporation source 1-1, and the thermal evaporation source 1-1 is provided with a concave cavity for placing the crucible 2-1.

[0114] The storage chamber 2 is provided with a crucible storage rack 2-2 and a manipulator 2-3; the manipulator 2-3 is used for transporting the crucible 2-1 between the thermal evaporation source 1-1 and the crucible storage rack 2-2 .

[0115] The structural rep...

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PUM

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Abstract

The invention provides a high-flux thermal evaporation thin film preparation device and application thereof. The high-flux thermal evaporation thin film preparation device comprises an evaporation cavity and a storage cavity, wherein the evaporation cavity communicates with the storage cavity through a flexible connection pipeline, a cut-off piece is arranged on a communicating pipeline of the evaporation cavity and the storage cavity, a thermal evaporation source is arranged in the evaporation cavity and is provided with a concave cavity for placing a crucible, a crucible storage rack and a manipulator are arranged in the storage cavity, and the manipulator is used for transporting the crucible between the thermal evaporation source and the crucible storage rack. According to the high-flux thermal evaporation film preparation device and the application thereof, through arrangement of the storage cavity, the crucible can be replaced in a vacuum environment, so that alternate coating of various materials is realized, and the use efficiency of the equipment is improved.

Description

technical field [0001] The invention belongs to the technical field of coating, and relates to a coating device, in particular to a high-flux thermal evaporation film preparation device and its application. Background technique [0002] In traditional material research, one sample is prepared in one experiment, so the material development cycle is long. High-throughput material chip technology draws on the mask technology used to manufacture integrated circuit chips. Thousands of materials with different components can be prepared in one experiment on one substrate, and the composition, structure, and phase can be quickly characterized, which can greatly shorten the processing time. R&D cycle of new materials. High-throughput material chip technology has become an important method for material research and development. [0003] At present, the evaporation source used for thermal evaporation can only put one evaporation material at a time. If it is necessary to change the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C30B23/02
CPCC23C14/24C23C14/243C30B23/02
Inventor 冯秋洁杨露明
Owner HANGZHOU GALAXY MATERIALS TECH CO LTD
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