Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Interconnected radial phase change micro-channel radiator

A micro-channel and radial technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of reducing the cooling efficiency and thermal uniformity of radiators, and the decline of fluid convective heat transfer, etc., to achieve Delayed boiling flow instability phenomenon, simple and clear micromachining and packaging process, and improved cooling capacity

Active Publication Date: 2021-07-02
上海碧桂青科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This phenomenon reduces the convective heat transfer effect of the fluid away from the inlet, thereby reducing the overall cooling efficiency and thermal uniformity of the radiator

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Interconnected radial phase change micro-channel radiator
  • Interconnected radial phase change micro-channel radiator
  • Interconnected radial phase change micro-channel radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0031] Such as figure 1 and figure 2 As shown, an interconnected radial phase-change microchannel radiator includes a chassis 2 and a cover plate 1 oppositely arranged. The cover plate 1 serves as a flow guide for the inlet and outlet of the cooling working fluid, and as a microchannel upper surface;

[0032] The chassis 2 is provided with a microchannel 5, and the microchannel 5 develops from the center of the chassis 2 to the periphery of the chassis 2 in an interconnected radial manner. The center of the cover plate 1 and the chassis 2 is provided with a cooling medium inlet 3, and the cover plate 1 and the chassis 2 The cooling medium outlet 4 is arranged at the edge of the chassis 2, and the chassis 2 transfers the heat of the cooling equipment to the cooling fluid, and the cooling fluid flows from the center of the chassis 2 to the surrounding edges of the chassis 2 along the direction of the microchannel 5, thereby taking away the heat.

[0033] Wherein, the cross-se...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an interconnected radial phase change micro-channel radiator, which comprises oppositely arranged base plates and a cover plate above the base plates, micro-channels are arranged on the base plates, the micro-channels develop from the centers of the base plates to the peripheries of the base plates in an interconnected radial manner, cooling working medium inlets are formed in the center positions of the cover plate and the base plates, and cooling working medium outlets are formed in the edge positions of the cover plate and the base plate. Compared with the prior art, by means of the interconnected radial micro-channel structures, mutual connection of the multiple layers of short-distance fork-shaped micro-channels and introduction of two node basic unit structures, pressure drop loss caused by fluid phase change can be effectively reduced, power consumption of the radiator is reduced, and the stability of the radiator is improved; and the cooling capacity can be improved, the temperature of the chip can be maintained to be uniform, and the phenomenon of boiling flow instability can be delayed.

Description

technical field [0001] The invention relates to the technical field of semiconductor phase change heat dissipation, in particular to an interconnected radial phase change microchannel heat sink. Background technique [0002] At present, high-efficiency cooling technology for high-power-density semiconductors has become the key to the development of the semiconductor chip industry. Among them, one of the most promising technologies currently recognized is the microchannel phase change cooling technology based on the phenomenon of flow boiling. By introducing the transfer mechanism of boiling phase change, combined with the inherent ultra-high specific surface area of ​​the microchannel heat sink, it can significantly improve Heat transfer coefficient, control chip temperature and reduce cooling fluid flow and pumping. [0003] However, at a higher heat flux density, due to the violent phase change of the cooling liquid into vapor, the volume of the fluid in the microchannel ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/367H01L23/427H01L23/433
CPCH01L23/367H01L23/427H01L23/433
Inventor 潘振海黄昊祥
Owner 上海碧桂青科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com