Processing method of resistance copper foil material for mobile phone vibration motor PCB

A technology of vibration motor and processing method, which is applied in the direction of removing conductive materials, metal pattern materials, electrical components, etc. by chemical/electrolytic methods, and can solve problems such as unstable resistance and poor resistance accuracy

Inactive Publication Date: 2021-07-06
东莞市科佳电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Mobile phone vibration motor PCB is often processed by traditional carbon-resistance ink printing process. The resistance value of carbon-resistanc

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for processing a resistive copper foil material for a mobile phone vibration motor PCB, comprising the following steps:

[0034] 1) Cutting: provide a halogen-free resistance copper foil plate for cutting, and reserve;

[0035] 2) Lamination: Press the resistance copper foil plate, the dielectric material and the common copper foil together to obtain the laminated plate, which is ready for use;

[0036] 3) Drilling: place the laminated sheet after pressing in step 2) on a positioning hole punch to make a positioning hole, and drill out blind holes and through holes;

[0037] 4) Electroplating: compare the processed laminated sheet in step 3) to electroplate the through-hole copper thickness of 23 μm, and electroplate the blind hole copper thickness of 12 μm, for standby;

[0038] 5) Outer layer dry film, carry out film processing to the outer layer graphics of the laminated sheet processed in step 4), make the circuit, and the PAD near line is not compensated,...

Embodiment 2

[0051] A method for processing a resistive copper foil material for a mobile phone vibration motor PCB, comprising the following steps:

[0052] 1) Cutting: provide a halogen-free resistance copper foil plate for cutting, and reserve;

[0053] 2) Lamination: Press the resistance copper foil plate, the dielectric material and the common copper foil together to obtain the laminated plate, which is ready for use;

[0054] 3) Drilling: place the laminated sheet after pressing in step 2) on a positioning hole punch to make a positioning hole, and drill out blind holes and through holes;

[0055] 4) Electroplating: compare the processed laminated sheet in step 3) to electroplate the through-hole copper thickness of 24 μm, and electroplate the blind hole copper thickness of 13 μm, for standby;

[0056] 5) Outer layer dry film, carry out film processing to the outer layer graphics of the laminated sheet processed in step 4), make the circuit, and the PAD near line is not compensated,...

Embodiment 3

[0069] A method for processing a resistive copper foil material for a mobile phone vibration motor PCB, comprising the following steps:

[0070] 1) Cutting: provide a halogen-free resistance copper foil plate for cutting, and reserve;

[0071] 2) Lamination: Press the resistance copper foil plate, the dielectric material and the common copper foil together to obtain the laminated plate, which is ready for use;

[0072] 3) Drilling: place the laminated sheet after pressing in step 2) on a positioning hole punch to make a positioning hole, and drill out blind holes and through holes;

[0073] 4) Electroplating: compare the processed laminated sheet in step 3) to electroplate through-hole copper thickness 25 μm, and electroplate blind hole copper thickness 14 μm, for later use;

[0074] 5) Outer layer dry film, carry out film processing to the outer layer graphics of the laminated sheet processed in step 4), make the circuit, and the PAD near line is not compensated, and other s...

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PUM

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Abstract

The invention relates to the technical field of electronic materials, in particular to a processing method of a resistance copper foil material for a mobile phone vibration motor PCB. The method comprises the following steps: providing a resistor copper foil plate, and carrying out cutting treatment, pressing treatment, drilling treatment, electroplating treatment, outer layer film drying, outer layer etching treatment, etching, film drying, differential etching treatment, ink printing, gold plating and lead etching to obtain the resistor. According to the processing method, the resistor copper foil material is adopted to replace a traditional carbon resistor printing ink printing technology, the prepared resistor copper foil material enables the electroplating resistance value of the PCB to be more stable, the precision is higher, and the product yield can be improved; the method is simple and easy to control, high in production efficiency, stable in product quality and beneficial to industrial production.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a method for processing a resistive copper foil material for a vibration motor PCB of a mobile phone. Background technique [0002] At present, with the development of science and technology and the progress of society, mobile phones have increasingly played a very important role in people's daily life. The mobile phone vibration motor is a vibration motor applied to a mobile phone, and its main function is to make the mobile phone vibrate. Mobile phone vibration motor PCB is often processed by traditional carbon-resistance ink printing process. The resistance value of carbon-resistance ink changes with the temperature of baking. The resistance value is unstable and the resistance accuracy is poor, which needs further improvement. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the object of the present i...

Claims

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Application Information

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IPC IPC(8): H05K1/09H05K3/06
CPCH05K1/09H05K3/06H05K2201/0355
Inventor 廖发盆徐承升陈军民夏军王海平
Owner 东莞市科佳电路有限公司
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