Assembly system for thin parts

Abstract

The invention discloses an assembly system for thin parts. The assembly system comprises a 3D printing unit, a carrying unit, a three-dimensional warehouse unit, a feeding unit, an assembling unit, a spray painting unit, a packaging unit and a master control unit, and the three-dimensional warehouse unit comprises a three-dimensional warehouse frame, a stacking machine and a butt joint mechanism; the feeding unit comprises a gantry carrying mechanism, two picking mechanisms, a gluing mechanism, a jacking mechanism, a visual inspection assembly module and two linear conveying lines; the assembling unit comprises a gantry carrying mechanism, a robot, a movable assembling table, a screw driving mechanism and two linear conveying lines; the spray painting unit comprises a transfer robot assembly, a detection table, an overturning table, spray painting equipment, a lifting and pushing mechanism and two linear conveying lines; the packaging unit comprises a butt joint table, a gantry carrying mechanism, a spider hand robot, a material transferring mechanism and two linear conveying lines; and the linear conveying lines on all the units sequentially communicate with one another. The assembly system is formed by a plurality of independent units which are convenient to assemble or disassemble, and is convenient to use and high in automation degree.

Description

technical field [0001] The invention relates to the technical field of assembly equipment, in particular to an assembly system for thin parts. Background technique [0002] With the development of the Internet of Things technology, radio frequency identification technology UHF RFID is one of the key technologies of the Internet of Things. UHF RFID technology is a non-contact automatic identification technology that automatically identifies target objects and obtains relevant information through radio frequency signals Data, without the need to establish mechanical or optical contact between the identification system and a specific target, strong signal penetration, long distance, long service life, good environmental adaptability, simultaneous identification of multiple tags, etc., have been applied to varying degrees in recent years , the electronic label is usually composed of a chip and a shell connected by screws; with the maturity of mobile storage technology, people's ...

AI Technical Summary

Problems solved by technology

[0002] With the development of the Internet of Things technology, radio frequency identification technology UHF RFID is one of the key technologies of the Internet of Things. UHF RFID technology is a non-contact automatic identification technology that automatically identifies target objects and obtains relevant information through radio frequency signals Data, without the need to establish mechanical or optical contact between the identification system and a specific target, strong signal penetration, long distance, long service life, good environmental adaptability, simultaneous identification of multiple tags, etc., have been applied to varying degrees in recent years , the electronic label is usually composed of a chip and a shell connected by screws; with the maturity of mobile storage technology, people's demand for U disk is not limited to the only storage function and mini shape, but also has a beautiful appearance and is easy to carry. Lost, with the function of advertising, the card U disk is in the same square or disc shape as the standard bank card, and can be divided into two types of card U disks, plug-in type and flip type, according to the different ways of opening the memory chip. Due to the waterproof function of the flip type, the demand is relatively large. However, in the card U disk assembly industry, the existing assembly methods for card U disks are manual assembly line operations, which not only has low work efficiency, but also due to manual uncertainty. The quality and quantity cannot be guaranteed; because the existing electronic label assembly system or card U disk assembly system can only meet the assembly and use of corresponding products, the utilization rate is low, the production cost is high, and usually multiple modules are integrated into one , cannot be split or combined at will, which will result in low system utilization efficiency and waste of assets

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