Thick material cutting method for dynamically controlling three-dimensional track of laser spot and system of method

Abstract

The invention discloses a thick material cutting method for dynamically controlling a three-dimensional track of a laser spot and a system of the method, and belongs to the field of laser processing. The system comprises a laser device for emitting lasers. A collimating lens is used for collimating and distributing laser beams, a reflector is used for changing the light path of the collimated laser beams, a focusing lens assembly is used for focusing the collimated laser beams, the focused lasers are emitted to a to-be-cut thick material, a focus light spot of the lasers is controlled to fall into the to-be-cut thick material, the focus light spot of laser cutting is moved along a preset cutting track, and cutting of the thick material is completed; in the cutting process, the focus light spot is controlled to conduct high-frequency vibration on the cutting track, and the high frequency ranges from 1.5 kHz to 4 kHz; and through dynamic control over the three-dimensional track of the laser spot, high-frequency movement of the spot focus in all directions of the optical axis is achieved, and therefore energy distribution of a section heat affected zone of a thick material workpiece is adjusted, the phenomena of slag adhering, thick stripes and the like generated by laser cutting of the section are avoided, and the section processing quality is improved.

Description

technical field

[0001] The invention belongs to the field of laser processing, and in particular relates to a method and system for cutting thick materials with dynamic control of three-dimensional trajectory of laser spot. Background technique

[0002] Laser processing is a processing method in which the workpiece is placed under a focused beam of high energy density, and the surface of the workpiece is eroded by using the photothermal effect. With the development of laser processing technology, because the focused beam has the advantages of high energy density and high concentration during laser processing, laser processing is becoming more and more important in the field of material processing.

[0003] However, in the field of laser thick material processing, due to the influence of laser processing power, laser spot energy distribution and laser beam quality, in the actual production process of laser processing of thick material workpieces, the thick material processing...

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