Resin composition for temporary fixing use, resin film for temporary fixing use, sheet for temporary fixing use, and method for manufacturing semiconductor device
A resin composition and temporary fixation technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, novolak epoxy resin adhesives, etc. The circle is prone to warping and other problems
Active Publication Date: 2021-07-30
RESONAC CORPORATION
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, since circuits are formed on the surface side of semiconductor wafers to be subjected to the grinding process, warping tends to occur when the thickness is reduced by grinding.
BG tape is a tape material that is easily strained, so it cannot fully support the thinned semiconductor wafer, and warpage is likely to occur in the semiconductor wafer
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～5、 comparative example 1～8
[0163] [Preparation of resin film for temporary fixation]
[0164] The varnishes of Examples and Comparative Examples were prepared in compositions of parts by mass shown in Tables 1 to 3, respectively. The prepared varnish was coated on the release-treated surface of a release-treated polyethylene terephthalate film (manufactured by Teijin Film Solutions Limited, A31, thickness 38 μm), and dried by heating at 90° C. for 5 minutes And it heat-dried at 140 degreeC for 5 minutes, and the 1st resin layer was formed. The second resin layer was formed using the same varnish, and a temporary fixing resin film was obtained through the first resin layer and the second resin layer. Then, a protective film was bonded on the resin film for temporary fixation, and the resin film for temporary fixation with a protective film and a support film was obtained.
[0165] [Table 1]
[0166]
[0167] [Table 2]
[0168]
[0169] [table 3]
[0170]
[0171] Details of each component d...
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Abstract
A resin composition for temporary fixing use according to the present invention can be used for the formation of a temporary fixing material for use in a semiconductor wafer processing method comprising a temporary fixing step of temporarily fixing the semiconductor wafer onto a support with the temporary fixing material interposed therebetween, a processing step of processing the semiconductor wafer that has been temporarily fixed onto the support, and a separation step of separating the processed semiconductor wafer from the temporary fixing material, the resin composition comprising (A) a thermoplastic resin, (B) a heat-curable resin and (C) a silicone compound, and having a shear viscosity of 4000 Pa.s or less at 120 DEG C, wherein the change ratio of the shear viscosity of the resin composition after the resin composition is allowed to leave under an atmosphere having a temperature of 25 DEG C for seven days is within 30%.
Description
technical field [0001] The present invention relates to a resin composition for temporary fixing, a resin film for temporary fixing, a sheet for temporary fixing, and a method for manufacturing a semiconductor device. Background technique [0002] As electronic devices such as smartphones (Smart Phones) and tablet PCs (Tablet PCs) become multifunctional, stacked multi-chip packages (MCPs), which achieve higher capacity by laminating multiple layers of semiconductor elements, are gaining popularity. In mounting a semiconductor element, a film-like adhesive is widely used as an adhesive for die bonding. However, the current connection method of semiconductor elements using wire bonding has a limit in data processing speed, and thus tends to slow down the operation of electronic equipment. In addition, in order to keep the power consumption low, there is an increasing need to use the battery for a longer period of time without charging, so power saving is also required. From ...
Claims
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IPC IPC(8): C09J133/04C09J161/04C09J163/00H01L21/02
CPCH01L21/02C09J133/068C08F220/1804H01L21/6835H01L2221/68327H01L2221/6834H01L2221/68381H01L2221/68336H01L21/6836C09D163/04C09J163/04C09J161/00C08F220/20C08F220/325C08L61/00C08L63/00C08K3/36C08K9/06C08L33/068C08L83/12C09J133/04C09J161/04C09J163/00C09J2301/312C09J2203/326H01L2221/68386
Inventor 祖父江省吾大山恭之山口雄志
Owner RESONAC CORPORATION